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Integrated circuit module

A technology of integrated circuits and components, applied in the field of semiconductor packaging components, can solve problems such as adverse effects on the performance of multiple electronic devices, achieve the effects of improving heat dissipation, reducing interconnection resistance, and simplifying design

Inactive Publication Date: 2014-05-28
SILERGY SEMICON TECH (HANGZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of this, the object of the present invention is to provide an integrated circuit assembly to solve the problem that the electrical connection of multiple electronic devices adversely affects its performance

Method used

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Embodiment Construction

[0042] Various embodiments of the invention will be described in more detail below with reference to the accompanying drawings. In the various drawings, the same elements are denoted by the same or similar reference numerals.

[0043] For the sake of clarity, various parts in the drawings have not been drawn to scale. For simplicity, the component structure obtained after several steps can be described in one figure. Furthermore, certain well-known details may be omitted, eg, solder and encapsulant are not shown in all drawings, support material for supporting a leadframe and / or an external frame are not shown in some drawings.

[0044] It should be understood that when describing a component structure, when a layer or a region is referred to as being “on” or “over” another layer or another region, it may mean that it is directly on another layer or another region, or on the There are other layers or regions between it and another layer or another region. And, if the device...

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Abstract

The invention discloses an integrated circuit module which comprises a semiconductor unpacked chip, a first insulating layer and power buses with the number of i, wherein the semiconductor unpacked chip comprises a plurality of electronic devices which are divided into m groups; each electronic device comprises electrodes with the number of n, wherein the electrodes have different polarities, and m and n are integers which are more than 1; the first insulating layer is arranged above the surface of the semiconductor unpacked chip; the power buses with the number of i are respectively arranged at a plane extending part on the first insulating layer and a plurality of vertical channel parts of the electrodes passing through a first insulating layer connector, wherein i is an integer which is more than 1 and less than or equal to m*n; at least one of the power buses with the number of i is used for electrically connecting the electrodes of at least two electronic devices; and all the power buses with the number of i are respectively taken as an external connection terminal. After the integrated circuit module is adopted, a lead frame of a finger-shaped pin can be avoided being used, so that the design of the lead frame is simplified, an interconnection resistor is reduced, and the heat dissipation is improved.

Description

technical field [0001] The present invention relates to semiconductor package assemblies, and more particularly to integrated circuit assemblies for use in switching regulators. Background technique [0002] Switching regulators, such as DC-DC converters, are used to provide a stable voltage source for a variety of electrical systems. High-efficiency DC-DC converters are especially needed for battery management in low-power devices (such as laptops, cell phones, etc.). Switching regulators convert the input DC voltage to a high frequency voltage, and then filter the high frequency output voltage to convert it to a DC output voltage. [0003] figure 1 A circuit schematic of a typical switching regulator 10 is shown. The switching regulator includes a control stage and a power stage. The control stage includes the control chip U1. The power stage includes power devices Q1 and Q2. Power devices are, for example, field effect transistors or bipolar transistors. The power ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/528
CPCH01L2224/16245H01L2924/1305
Inventor 叶佳明谭小春
Owner SILERGY SEMICON TECH (HANGZHOU) CO LTD
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