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Electronic microneedle assembly for in situ skin gene transfer and preparation method thereof

A technology of integrated body and microneedle, which is applied in the direction of skin-piercing electrodes, microneedle, electrotherapy, etc., can solve the problem of difficult preparation of monolithic integrated body, and achieve the effect of improving efficiency

Active Publication Date: 2017-05-03
RAPHAS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to fabricate a monolithic assembly that integrates dissolvable microneedles and electroporation electrodes into one structure using the conventional forming method for fabricating dissolvable microneedles, i.e., microcasting.

Method used

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  • Electronic microneedle assembly for in situ skin gene transfer and preparation method thereof
  • Electronic microneedle assembly for in situ skin gene transfer and preparation method thereof
  • Electronic microneedle assembly for in situ skin gene transfer and preparation method thereof

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Embodiment Construction

[0020] Hereinafter, an electronic microneedle assembly and a manufacturing method thereof according to exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0021] figure 1 A flowchart showing a method for preparing an electronic microneedle assembly according to an embodiment of the present invention, figure 2 and image 3 An approximate perspective view of the electroporation electrode is shown, and Figure 4 and Figure 5 An approximate flowchart of the microneedle formation method is shown.

[0022] see Figure 1-Figure 5 , The method (M100) for preparing an electronic microneedle assembly according to an embodiment of the present invention includes: preparing an electroporation electrode (S10), preparing a mixed composition (S20), and forming a microneedle (S30).

[0023] The preparation of the electroporation electrode (S10) is the step of preparing the electrode for electroporation. The electropo...

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Abstract

The present invention relates to an electronic microneedle assembly in which dissolvable microneedles and electroporation electrodes are integrated with each other for concentrated and efficient transdermal gene release at the site to be treated and a method for preparing the assembly. The gene is introduced into the target cell. The electronic microneedle assembly according to the present invention includes: a base part; an electroporation electrode including a plurality of electrode parts protruding from the base part, and the electroporation electrode is in contact with human skin to apply an electric field pulse; and contains a biocompatible and microneedles of biodegradable sticky material and genetic material, which are adhered to each electrode part and inserted into human skin. Thus, the microneedles can dissolve within the skin, and then the electroporation electrodes apply an electric field pulse at the site where the microneedles were inserted.

Description

technical field [0001] The invention relates to an electronic microneedle assembly and a preparation method of the electronic microneedle assembly, in which a dissolvable microstructure and an electroporation electrode are integrated into a structure for permeation at a treatment site Skin gene delivery. Background technique [0002] The purpose of gene delivery (gene transfer, delivery) and gene therapy is to replace genes in defective cells by introducing foreign genes into the human body, or to provide special functions by introducing needed genes to treat diseases or to study therapeutic models. In particular, gene transfer and gene therapy in the skin have attracted much attention due to the skin's accessibility and ease of monitoring, as well as the presence of various intradermal immune cells therein, however, the effective infusion of foreign genes into skin target cells and their stable In the study of expression delivery technology (gene delivery system), gene pen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61M37/00A61K48/00A61M5/158
CPCA61K9/0009A61K9/0021A61K48/0075A61M37/0015A61M2037/0046A61M2037/0053A61N1/042A61N1/0424A61N1/0476A61N1/0502A61K48/00A61M5/158A61M37/00A61N1/327B05D5/00
Inventor 丁炯一李光郑道铉金正东
Owner RAPHAS
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