Magnetron sputtering coating production line

Abstract

The invention discloses a magnetron sputtering coating production line. The magnetron sputtering coating production line comprises a machine base as well as a transmitting device, a loading region, a vacuum processing chamber group, an unloading region and a pass back circuit which are arranged on the machine base, the loading region, the vacuum processing chamber group, the unloading region and the pass back circuit are sequentially connected in rings and a processing loop circuit in continuous circulation operation is formed, and the transmitting device is arranged in the processing loop circuit in a continuous circulation operation manner; the vacuum processing chamber group comprises a feeding chamber, a front transition chamber, a front buffer chamber, a first coating chamber, a second coating chamber, a third coating chamber, a rear buffer chamber, a rear transition chamber and a discharging chamber which are sequentially connected along transmission direction of the transmitting device, target material is respectively arranged in the first coating chamber, the second coating chamber and the third coating chamber, a movable magnet close to corresponding target material and a regulating mechanism used for regulating the magnet are respectively arranged outside the first coating chamber, the second coating chamber and the third coating chamber, each regulating mechanism comprises a magnetism shifting regulating component and a magnetism dividing regulating component, and the magnetism shifting regulating component and the magnetism dividing regulating component are respectively connected with the magnet.

Description

technical field [0001] The invention relates to the field of magnetron sputtering coating, in particular to a magnetron sputtering coating production line. Background technique [0002] As we all know, magnetron sputtering is to perform high-speed sputtering under low gas pressure, and the ionization rate of the gas must be effectively increased. By introducing a magnetic field on the cathode surface of the target, the confinement of the charged particles by the magnetic field is used to increase the plasma density to increase the sputtering rate; that is, a closed magnetic field parallel to the surface of the target is added in the diode sputtering, with the help of the target The orthogonal electromagnetic field formed on the surface of the target material binds the secondary electrons to a specific area on the surface of the target material to enhance the ionization efficiency, increase the ion density and energy, and thus realize the process of high-speed sputtering. ...

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Problems solved by technology

[0003] In the existing magnetron sputtering coating production line, the magnetic field is usually provided by a plate-shaped rectangular parallelepiped magnet. Although the magnetron sputtering technology is becoming more and more mature, it still has many defects. On the one hand, due to the plate The magnetic field distribution of the magnet with a cuboid structure is uneven, which causes the uneven distribution of the magnetic field in the area where the target is located, making the movement of the secondary electrons in the bipolar sputtering unstable and uneven, and finally leads to The coated glass substrate has uneven coating distribution and inconsistent coating thickness, which seriously affects the coating quality and pass rate of the glass substrate; on the other hand, since the magnet is often fixed relative to the target and cannot move, for When the target area is large and the magnetic field generated by the magnet is small, the utilization rate of the target and the sputtering range are limited, the target cannot be fully utilized, and the target that is not in the magnetic field action area is wasted. And greatly restricted the processing efficiency of glass substrate coating, and also can produce certain bad influence to the coating quality and qualified rate of glass substrate; Moreover, existing magnetron sputtering coating production line also has complex structure, The shortcomings of low coating processing efficiency, high cost of glass substrate coating processing, poor process versatility and inability to meet mass production needs

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