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Electroless palladium plating bath composition

A palladium alloy, electroless deposition technology, applied in liquid chemical plating, metal material coating process, coating and other directions

Active Publication Date: 2014-06-11
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Plating rates for palladium or palladium alloy deposition are already severely reduced in the presence of 5 ppm or even less copper ions in the electroless plating bath

Method used

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  • Electroless palladium plating bath composition
  • Electroless palladium plating bath composition
  • Electroless palladium plating bath composition

Examples

Experimental program
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Effect test

Embodiment Construction

[0078] overall steps

[0079] In all examples, a test piece comprising a copper surface (50 x 50 mm) was always used as the substrate. The coupons were activated by immersion palladium plating in an aqueous solution of palladium acetate, sulfuric acid and complexing agent (pH = 2.5), followed by washing with water.

[0080] In all examples, 10 mmol / l palladium ions and 500 mmol / l sodium formate were used as reducing agents in the electroless palladium plating bath composition. In all cases, the phosphorus-free nitriding complexing agent was ethylenediamine. In all experiments, the pH of the plating bath was adjusted to 5.5.

[0081] After 5 minutes of immersion in the different electroless palladium plating bath compositions tested, the X-ray fluorescence method (XRF; Fischer, Fischerscope ? X-Ray XDV ? - μ) Determining the thickness of the palladium layer. In all examples, the temperature of the electroless plating bath was maintained at 52°C during palladium depositi...

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Abstract

The present invention concerns an aqueous plating bath composition for electroless deposition of palladium and / or palladium alloys and a method which utilises such aqueous plating bath compositions. The aqueous plating bath comprises a source of palladium ions, a reducing agent, a nitrogenated complexing agent which is free of phosphorous and at least one organic stabilising agent comprising 1 to 5 phosphonate residues. The aqueous plating bath and the method are particularly useful if the aqueous plating bath comprises copper ions.

Description

field of invention [0001] The present invention relates to plating bath compositions and methods for the electroless deposition of palladium and palladium alloys in the manufacture of printed circuit boards, IC substrates and semiconductor devices. [0002] Background of the invention [0003] Electroless deposition of palladium and palladium alloys is an established technique in the fabrication of printed circuit boards, IC substrates, etc., and metallization of semiconductor wafers. The palladium or palladium alloy layer serves as a barrier layer and / or a wireable and solderable finish. [0004] The type of palladium deposit (pure palladium or palladium alloy) obtained by electroless plating depends on the reducing agent used. [0005] Formic acid, its derivatives and its salts give pure palladium deposits. Phosphorus-containing reducing agents, such as sodium hypophosphite, yield palladium-phosphorus alloys. Borane derivatives were used as reducing agents to obtain pal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44
CPCC23C18/44C23C18/1637
Inventor I-R.希尔泽科恩J.韦格里希特A.基利安
Owner ATOTECH DEUT GMBH