Closed-loop control high-precision positioning lifting system of full-automatic solder paste printer

Abstract

The invention discloses a closed-loop control high-precision positioning lifting system of a full-automatic solder paste printer. The closed-loop control high-precision positioning lifting system comprises a support with a power drive device, and a driving synchronous pulley is arranged on the power drive device. A guide device is arranged on the support, and a lifting rack is arranged on the guide device. A power transmission device is arranged on the support, and a driven synchronous pulley is arranged on the power transmission device. An electronic induction device and a stroke buffer device are assembled on the support. According to the scheme, precision lead screws are driven by a precision servo motor to rotate, and then the lifting rack can precisely move and can be precisely positioned along a linear guide rail; the problems that a lifting rack with large inertia is low in control and positioning precision and response speed, poor in stability and the like are solved. According to the scheme, due to the adoption of a ball nut lead screw pair, the transmission friction torque moment is small, efficiency is high, motion is smooth, and precision is high; the structural strength of the lifting rack and the support is greatly improved; a linear guide rail sliding block is adopted in the guide device, smoothness is high, and errors are small.

Description

technical field [0001] The invention relates to a circuit board manufacturing equipment, in particular to a closed-loop control high-precision positioning lifting system of a fully automatic solder paste printing machine. Background technique [0002] The existing surface mount technology has undergone tremendous changes in recent years. Electronic products are developing towards miniaturization, light weight and high reliability, which makes surface mount electronic components continue to develop towards thinner and smaller high integration. The advent of surface mount technology on circuit boards has created new challenges. The first process of surface mounting of circuit boards is completed by a solder paste printing machine, which is very important. At present, the lifting system of the fully automatic solder paste printing machine in the known field uses air pressure to drive the piston rod to move in the cylinder, so that the piston drives the lifting frame to move in...

AI Technical Summary

Problems solved by technology

At present, the lifting system of the fully automatic solder paste printing machine in the known field uses air pressure to drive the piston rod to move in the cylinder, so that the piston drives the lifting frame to move in a straight line. The positioning accuracy is low, and the lifting frame cannot accurately stay at the predetermined position. Thus affecting the printing accuracy

[0003] The lifting system of the traditional automatic printing machine has the following disadvantages: slow response speed, low positioning accuracy, poor structural stability, open-loop control

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