Method for monitoring the status of equipment and machines

A monitoring equipment and machine technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as non-compliance with process requirements, detection of working conditions of control substrates, abnormal semiconductor wafers, etc., to avoid The effect of abnormal product, reduction of scrap, and yield

Active Publication Date: 2017-01-25
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the working status of the control board itself cannot be completely detected by the existing software system
That is to say, when there is a problem in the self-judgment of the control board, it will notify the equipment to alarm, stop production, and manually intervene; Alarm, production will not stop, the semiconductor wafer produced is abnormal, does not meet the process requirements, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for monitoring the status of equipment and machines
  • Method for monitoring the status of equipment and machines

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The method for monitoring the state of the equipment machine of the present invention will be described in more detail below in conjunction with schematic diagrams, wherein a preferred embodiment of the present invention is represented, and it should be understood that those skilled in the art can modify the present invention described here and still implement the present invention beneficial effect. Therefore, the following description should be understood as the broad knowledge of those skilled in the art, but not as a limitation of the present invention.

[0022] In the interest of clarity, not all features of an actual implementation are described. In the following description, well-known functions and constructions are not described in detail since they would obscure the invention with unnecessary detail. It should be appreciated that in the development of any actual embodiment, numerous implementation details must be worked out to achieve the developer's specific...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a method for monitoring conditions of an equipment machine table. An EAP server is used for collecting operation condition data of equipment and inputting the data into a database, the data are processed and analyzed through the server, and therefore whether a control substrate is abnormal or not is judged, the purpose of monitoring the control substrate in real time is achieved, faults are detected in time, technical personnel are informed in time to handle the faults correspondingly, larger damage is avoided, the use rate of the equipment machine table is improved, and certain economical benefits are achieved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for monitoring the status of equipment and machines. Background technique [0002] The equipment and machines used in the semiconductor industry are usually high-precision equipment, embedded with many control boards to control the corresponding actions and functions of different components. For example, Nikon's stepping lithography machine and scanning lithography machine are high-precision equipment with more than 100 control boards installed. [0003] However, the working condition of the control substrate itself cannot be completely detected by the existing software system. That is to say, when there is a problem in the self-judgment of the control board, it will notify the equipment to alarm, stop production, and manually intervene; If the alarm is issued, the production will not stop, and the semiconductor wafers produced are abnormal and do not meet th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67276
Inventor 葛斌
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap