Silicon rod with chamfered guide strip

Abstract

The invention discloses a silicon rod with a chamfered guide strip. The guide strip is arranged on the side face of the silicon rod, the side face is a face which is contacted firstly during steel wire feeding, the guide strip is bonded on a first side face of the silicon rod, the bonded position of the guide strip is parallel to an edge at a chamfer of the silicon rod, and two end faces of the guide strip are parallel to two end faces of the silicon rod. By the silicon rod, wire mesh cutting can be enabled to be more uniform during silicon rod processing, and broken-edge pieces, uneven-thickness pieces, cracking pieces and the like are reduced.

Description

technical field [0001] The invention relates to a silicon rod, in particular to a silicon rod provided with chamfering guide strips, and belongs to the field of silicon rod processing in the production of solar silicon rods. Background technique [0002] At present, during the cutting process of silicon rods, due to the unstable wire mesh when entering the knife, the steel wires are easy to slip, resulting in thick slices, slivers, and severe cases will cause wire pressure and wire breakage; due to the cutting of silicon carbide during the cutting process, The capacity changes, the particle size varies, and the amount of slurry is relatively large when the steel wire enters the knife and the crystal rod. This phenomenon is likely to cause the thickness of the silicon rod in the opposite direction of the steel wire to vary. average; when the wire net is fed to a certain depth, a wire bow is generated, and the force on the junction area between the side of the silicon rod and ...

AI Technical Summary

Problems solved by technology

[0002] At present, during the cutting process of silicon rods, due to the instability of the wire mesh when entering the knife, the steel wires are easy to slip, resulting in thick slices, slivers, and severe cases will cause crimping and broken wires; The ability is changing, the particle size varies, and the amount of slurry is relatively large when the steel wire enters the knife and the steel wire enters the ingot. average; when the wire net is fed to a certain depth, a wire bow is generated, and the force on the junction area between the side of the silicon rod and the silicon rod facing the wire net is the largest, which makes it easy to cause chipping at the chamfer. These problems have always affected the quality of the silicon rod. cutting quality

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