Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A method for selective metallization of a ceramic surface and a ceramic

A ceramic surface and selective technology, applied in the field of ceramics, can solve problems such as poor bonding force and damage to ceramic performance, and achieve the effects of improving bonding force, fast deposition speed, and uniform surface

Active Publication Date: 2015-11-25
BYD CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the technical problems of the existing selective metallization of the ceramic surface that would destroy the performance of the ceramic itself and have poor bonding force, the present invention provides a selective metallization method of the ceramic surface that does not damage the performance of the ceramic itself and has good bonding force and ceramics

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Magnetron sputtering a layer of copper with a thickness of 2 μm on the surface of the 40mm×40mm×1mm alumina substrate, and then place the sample on the stage of the laser of Han’s (model EP-12) for marking. The laser wavelength is 1064nm, the power is 10W, the frequency is 25KHz, the line speed is 100mm / s, and the filling pitch is 0.1mm. Then put it in 20% H 2 SO 4 and 10%H 2 o 2 solution until the copper in the area not irradiated by the laser dissolves. Take out the sample, wash it 3 times in deionized water, and finally put it into 4: 0.15mol / l, potassium sodium tartrate: 0.14mol / l, EDTA: 0.14mol / l, potassium ferrocyanide: 1.7×10 -4 mol / l, pH=12.5, and temperature 50°C in an electroless copper plating solution for 1.5h to obtain sample A1.

Embodiment 2

[0034] Magnetron sputtering a layer of nickel with a thickness of 0.5 μm on the surface of a zirconia substrate of 40mm×40mm×1mm, and then placing the sample on the stage of a Han’s (model EP-12) laser for marking, the laser wavelength It is 200nm, the power is 5W, the frequency is 5KHz, the line speed is 10mm / s, and the filling pitch is 0.05mm. It is then placed in a solution containing 20% ​​sulfuric acid until the copper in the areas not marked by the laser dissolves. Take out the sample, wash it 3 times in deionized water, and finally put it into the 4 : 23g / l, sodium hypophosphite: 18g / l, lactic acid: 20g / l, malic acid: 15g / l, pH=5.2 (adjusted by NaOH), temperature: 1.5h in electroless nickel plating solution at 90°C , to obtain sample A2.

Embodiment 3

[0036] Protect the part of the surface of the anodized aluminum exposed to the aluminum with adhesive tape, and evaporate a layer of 1.5 μm thick Zn film on the Al 2 o 3 surface, and then place the sample on the stage of a Han’s (model EP-12) laser for marking. The laser wavelength is 3000nm, the power is 8W, the frequency is 100KHz, the line speed is 1000mm / s, and the filling pitch is 5mm. Then put it in 20% H 2 SO 4 solution until the copper in the areas not marked by the laser dissolves. Take out the sample, wash it 3 times in deionized water, and finally put it into 4 : 0.15mol / l, potassium sodium tartrate: 0.14mol / l, EDTA: 0.14mol / l, potassium ferrocyanide: 1.7×10 -4 mol / l, pH=12.8, and temperature 48°C in an electroless copper plating solution for 1.5h to obtain sample A3.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
wavelengthaaaaaaaaaa
Login to View More

Abstract

The invention provides a ceramic surface selective metallization method. The method comprises the following steps: step one, forming a metal film layer on the surface of a ceramic substrate; step two, utilizing laser to carry out radiation on selected regions on the surface of the metal film layer; step three, removing the metal film layer from the unselected regions; step four, carrying out chemical electroplating on the radiated regions; wherein the metal film layer is composed of at least one component of Cu, Ni, Zn, and Ti. The invention also provides a ceramic prepared by the method. Because of the local high temperature effect brought by the laser radiation, the metal diffuses into the ceramic, carries out reactions with the ceramic, and is welded into the ceramic, and thus the binding force between the metal and the ceramic is improved. At the same time, in the regions that are radiated by laser, the content of metal simple substance is increased, the surfaces of the regions are smooth, so metals in chemical electroplate fluid are induced to precipitate on the surfaces of the radiated regions, and the precipitation speed is accelerated.

Description

technical field [0001] The invention belongs to the field of ceramics, in particular to a ceramic surface selective metallization method and a ceramic. Background technique [0002] In order to integrate the electrical interconnection of circuit boards into structural parts, especially devices with three-dimensional three-dimensional structures, realize device protection, structural support and other functions in one, and ultimately improve device reliability, reduce volume, and achieve multi-function. Recently, many methods for forming three-dimensional circuits on the surface of ceramics have been developed, and three-dimensional circuits can be formed on the surface of ceramics, which can form a three-dimensional circuit carrier integrating electromechanical functions. At the same time, ceramic devices with three-dimensional circuits on the surface have high thermal conductivity and mechanical strength, long service life, strong aging resistance, etc., so they will be wid...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C04B41/88
Inventor 林信平任永鹏徐强
Owner BYD CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com