Implantable X-ray Imaging Method and Apparatus for Measuring Internal Temperature of Components

Abstract

The invention relates to an embedded X-ray imaging device for measuring the internal temperature of a component, which sequentially includes an X-ray tube, a lead plate with a through hole, a curved mercury temperature sensing element placed inside the component, and converts X-rays into visible light The imaging screen, the camera that collects the image information on the imaging screen, the image transmission unit that transmits the image information collected by the camera, and the processing and display unit, the component to be tested is placed between the lead plate and the imaging detector, and the curved mercury temperature sensing device The projection falls within the display range of the imaging screen. The invention uses the X-ray imaging principle to read the length of the mercury column through image processing, thereby accurately and reliably measuring the temperature inside the component, and realizing the non-contact measurement. The curved mercury temperature sensing element occupies a small space and requires less space inside the component. While measuring the temperature, it can also detect the internal working state of the object, such as whether there is damage, disconnection, etc., and is not disturbed by external factors such as strong electromagnetic fields.

Description

technical field [0001] The invention relates to a device and method for measuring internal temperature of a component, belonging to the technical field of detection and calibration, in particular to an embedded X-ray imaging method and device for measuring the internal temperature of a component. Background technique [0002] Modern temperature measurement methods mainly include infrared non-contact temperature measurement technology, thermocouple, thermistor temperature measurement technology and laser temperature measurement technology. These temperature measurement methods can only directly measure the temperature of the object or the surface of the structure, and cannot meet the requirements of measuring the internal temperature of the object or monitoring the internal temperature in many occasions. Such as electrical heating equipment such as electric cabinets, internal temperature measurement of cable joints, temperature measurement in boiler furnaces, and internal tem...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: to overcome the difficulty in the prior art that the internal temperature of objects or components is difficult to measure, to provide an embedded X-ray imaging method and equipment for measuring the internal temperature of components, and to realize accurate, simple and reliable Measurement of internal temperature of non-contact components

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