Sputtering systems for liquid target materials
A sputtering system and liquid target technology, applied in sputtering coating, semiconductor devices, metal material coating technology, etc., can solve the problems of no production environment, difficult and expensive alloy targets, etc.
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[0053] Magnetron components (such as figure 2 or image 3 shown) contains a horizontal magnetron with a gallium-containing liquid target and a rotatable magnetron with an indium-containing solid target. The flow of gallium and indium from the rotatable magnetron by applying DC power to the rotatable magnetron and horizontal magnetron while the rotatable magnetron is rotating at a rate of about 15 rpm And produced. A DC power of about 1 kW / ft target was applied to the horizontal magnetron; a DC power of about 3 kW / ft target was applied to the rotatable magnetron. chamber between the magnetrons (e.g. image 3 Chamber 17) operates at an argon pressure of about 5 millitorr (mTorr), the chamber with the magnetron assembly (e.g. image 3 The chamber 22) is operated at an argon pressure of about 3 mTorr.
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