Liquid-state metal electronic paste and preparation method thereof

A technology of liquid metal and electronic paste, which is applied in the field of electronics, can solve problems such as large contact resistance, high cost, and complex metal powder preparation process, and achieve the effects of improving adhesion, low paste cost, and reducing the formation of gaps

Inactive Publication Date: 2017-12-08
YUNNAN KEWEI LIQUID METAL VALLEY R & D CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a liquid metal electronic paste, which overcomes the technical problems of complex metal powder preparation process, high cost, and large contact resistance in the prior art conductive paste, and directly disperses the liquid low-melting point alloy in an organic solvent. In the method, the preparation and dispersion of molten metal particles are obtained in a one-step method to obtain a conductive paste in which all components are uniformly mixed

Method used

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  • Liquid-state metal electronic paste and preparation method thereof
  • Liquid-state metal electronic paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A liquid metal electronic paste, the formula of each component is shown in Table 1, and its preparation method is

[0043] 1) Weigh low-melting point alloys or elemental metals, binders, organic solvents, and functional additives according to the proportioning ratio;

[0044] 2) Add the binder and functional additives to the organic solvent in turn, stir while heating to dissolve and mix to form a uniform solution, and cool to room temperature for use; the heating temperature is kept at 60° C., and the stirring time is 1 h.

[0045] 3) Place the low-melting point alloy or elemental metal in vacuum (vacuum degree-0.1MPa) for constant temperature treatment until it changes into a liquid state; the constant temperature treatment time is 4h; the constant temperature treatment temperature is 10% higher than the melting point of the low melting point alloy. ℃;

[0046] 4) Add the homogeneous solution obtained in step 2) into the liquid metal obtained in step 3) under stirrin...

Embodiment 2-5

[0049] Liquid metal electronic paste, the formula of each component is shown in Table 1, and its preparation method is the same as that of Example 1.

[0050] Table 1: Liquid Metal Electronic Paste Components

[0051]

[0052]

[0053] The above-mentioned embodiment is the method and formulation of direct mechanical dispersion in the organic carrier to prepare the electronic paste when the low-melting-point metal is in liquid state. From Example 1 to Example 5, the melting point of the low-melting-point metal gradually increases, and the mass ratio is 80%. It can also be based on Actual demand is adjusted between 45% and 90%. In actual production, the proportion structure of the alloy can be adjusted according to the demand to achieve the required melting point value. For example, add or replace one or more of cadmium, lead, zinc, silver, gallium, copper, etc. in the bismuth, indium, and tin metals in the embodiment, including gallium indium, gallium tin, gallium mercur...

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Abstract

The invention proposes liquid-state metal electronic paste. The liquid-state metal electronic paste comprises an organic carrier and liquid-state metal, wherein the liquid-state metal is dispersed in the organic carrier, the organic carrier comprises an organic solvent, a binding agent and a functional additive, and the liquid-state metal is elemental metal or alloy with a melting point being (-78.2)-232 DEG C. The invention also provides a preparation method of the liquid-state metal electronic paste. In the electronic paste proposed by the invention, the liquid-state elemental metal or alloy with a low melting point, the organic carrier and the binding agent form a uniform phase, alloy particle is not needed to be prepared, and the paste is low in cost; an activating agent, a thixotropic agent, resin and the like are added into the organic carrier, the surface tension of the liquid-state metal is reduced, and the adhesion between the paste and a substrate is improved; and after sintering and curing, the organic solvent is volatilized after being heated, the elemental metal or alloy with the low melting point is heated and molten, particles are contacted and pasted to form lines, gaps among the particles are reduced, and the conductivity of the paste is improved.

Description

technical field [0001] The invention belongs to the field of electronic technology, and in particular relates to a metal-containing electronic paste and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics technology, electronic components are increasingly developing in the direction of miniaturization, integration and high frequency. As the key material of electronic components, electronic paste is playing an increasingly important role. In recent years, as a basic electronic material with specific functions, conductive paste has been widely used in many fields such as printed circuit boards, front and back electrodes of solar panels, RFID electronic tags, mobile phone antennas, and non-contact IC card antenna lines. . [0003] Conductive paste is a uniform paste or varnish made by mixing and rolling solid conductive powder, binder and organic vehicle. At present, the conduction process of the conductive paste is real...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 邓中山杜旺丽耿成都蔡昌礼刘静
Owner YUNNAN KEWEI LIQUID METAL VALLEY R & D CO LTD
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