Vacuum sucker for TSV silicon wafer

Abstract

The invention belongs to the technical field of photoetching of semiconductors, and relates to a TSV silicon wafer moving device, in particular to a vacuum sucker for a TSV silicon wafer. The vacuum sucker comprises a sucker base, an adsorption layer arranged on the upper portion of the sucker base, a vacuum chamber arranged inside the sucker base, and an adsorption hole group distributed on the adsorption layer in an array mode and communicated with the vacuum chamber, wherein the adsorption layer comprises a middle core part and an annular layer surrounding the core part, and the annular layer comprises at least one annular elastic adsorption layer and at least one annular rigid adsorption layer which are arranged in a sleeved mode. According to the sucker, the elastic adsorption layers are adopted, the adsorption area changes from inside to outside, point adsorption is changed into surface adsorption, and the firmness of TVS silicon wafer adsorption is improved; to prevent the warping of the TVS silicon wafer caused by the deformation of the elastic adsorption layers, the adsorption surface is designed in the way that the rigid adsorption layers and the elastic adsorption layers are arranged alternately in an annular mode and height difference is set, and in this way, the flatness of the TSV silicon wafer can still be kept during adsorption.

Description

technical field [0001] The invention belongs to the technical field of semiconductor lithography manufacturing, and relates to a moving device for TSV silicon wafers, in particular to a vacuum chuck for TSV silicon wafers. Background technique [0002] TSV is called Through-Silicon-Via (Through-Silicon-Via), which is a system-level integrated structure, which is formed by stacking multiple layers of silicon chips and connecting them through through holes in the normal direction of the plane. TSV silicon wafers have the advantages of the highest stacking density in three dimensions, the shortest interconnection lines between chips, the smallest size, and the ability to stack 3D chips. They are widely used in the fields of computers, communications, automotive electronics, and aerospace. [0003] In the prior art, vacuum suction cup technology is mainly used to clamp and transport silicon wafers, that is, the silicon wafers are attached to the suction cups by vacuum adsorption...

AI Technical Summary

Problems solved by technology

But in fact, as a bonded silicon wafer, the TSV silicon wafer has different geometric characteristics from other silicon wafers. In terms of positioning, the bottom of the TSV silicon wafer is a curved surface. See figure 1 , because the surface 101 of the traditional suction cup is made of ceramic material, the surface is not easily deformed, the contact area with the curved surface of the TSV silicon wafer 102 is small, and the adsorption is not firm

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