Mask plate

A mask and area technology, applied in the field of mask, can solve the problems of poor product quality, high cost, defectiveness, etc., and achieve the effect of reducing sag, reducing height and tight adhesion

Active Publication Date: 2014-07-09
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

When the mask is no longer attached to the substrate over the entire area, the boundaries of the material deposited in the openings are no longer precisely defined, which can

Method used

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Examples

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Example Embodiment

[0031] In the second embodiment, the mask plate 1 is made of iron-nickel alloy material, which includes: an opening portion (or opening) 2; a shielding portion 3; a solder joint 4; a first groove 6; and a second groove 5. Figure 8 Shown as Figure 4 Schematic diagram of the cross-section of the middle IV-IV' structure. Combine Figure 7 and Figure 8 It can be seen that the second groove 5 is arranged on the side of the mask plate 1 facing away from the substrate, and is arranged at the solder joints 4 on the edge of the mask plate 1, and the solder joints 4 are located in the second groove 5. The second groove 5 can accommodate one or more solder joints, the length of its short side is slightly larger than the diameter of the solder joint 4, the length of its long side is greater than the sum of the diameter of one or more solder joints 4, and its depth is greater than that of the solder joint 4 The height is generally in the range of 10um-20um, preferably 15um. The presence ...

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Abstract

The invention discloses a mask plate and a manufacturing method. The mask plate comprises a first zone and a second zone; the first zone is used for positioning, a welding positioning part between the mask plate edge and a mask plate frame (or support) is provided with a second groove, and the welding positioning part faces back to a substrate and is in the first zone, and the second groove is capable of accommodating one or multiple welding positioning devices; the second zone comprises shielding parts and opening parts which are uniformly arranged at intervals in a parallel manner, the side, facing to the substrate, of each shielding part is provided with first grooves, and each groove is parallel to the opening parts in the longitudinal direction or in the transverse direction. The invention also discloses a preparation method of the mask plate on which the first grooves and the second grove are arranged, and a wet-process etching method is employed. The mask plate has the advantages of light mass, good strength, reduced substrate damages and the like.

Description

technical field [0001] The invention relates to a mask, especially a mask structure for vacuum evaporation Background technique [0002] In some semiconductor manufacturing processes, a vapor deposition step is required in order to deposit a substance (organic or inorganic) onto a substrate. In some processes, substances must be deposited in precisely defined areas on the substrate. To simplify the deposition process, a mask is usually applied to one side of the substrate, with cutouts or openings in the mask defining the areas where the species is deposited. It is often desirable to deposit material precisely into the regions corresponding to the openings so that the boundaries of these regions are well defined. For example, during the manufacture of Organic Light Emitting Diodes intended for display or other light emitting applications, organic substances must be deposited in precisely defined areas. [0003] State-of-the-art masks such as figure 1 , figure 2 ,and ...

Claims

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Application Information

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IPC IPC(8): C23C14/04C23C16/04
Inventor 毕德锋叶添昇
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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