Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Mask plate

A mask and area technology, applied in the field of mask, can solve the problems of poor product quality, high cost, defectiveness, etc., and achieve the effect of reducing sag, reducing height and tight adhesion

Active Publication Date: 2014-07-09
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
View PDF5 Cites 43 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the mask is no longer attached to the substrate over the entire area, the boundaries of the material deposited in the openings are no longer precisely defined, which can lead to poor product quality
[0005] Uneven or stained edges of deposited areas are unacceptable in products such as OLED displays, and this poor quality can lead to high costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mask plate
  • Mask plate
  • Mask plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0031] The mask plate 1 in the second embodiment is made of iron-nickel alloy material, which includes: an opening part (or opening) 2'; a shielding part 3'; a solder joint 4; a first groove 6; and a second groove 5. Figure 8 shown as Figure 4 Schematic diagram of the cross-section of the structure of Ⅳ-Ⅳ′. combine Figure 7 and Figure 8 It can be seen that the second groove 5 is arranged on the side of the mask 1 facing away from the substrate, and it is arranged at the welding spot 4 on the edge of the mask 1 , and the welding spot 4 is located in the second groove 5 . Described second groove 5 can accommodate one or more solder joints, and its short side length is slightly greater than the diameter of solder joint 4, and its long side length is greater than the sum of one or more solder joint 4 diameters, and its depth is greater than the diameter of solder joint 4. The height is generally in the range of 10um-20um, preferably 15um. The existence of the second groove...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a mask plate and a manufacturing method. The mask plate comprises a first zone and a second zone; the first zone is used for positioning, a welding positioning part between the mask plate edge and a mask plate frame (or support) is provided with a second groove, and the welding positioning part faces back to a substrate and is in the first zone, and the second groove is capable of accommodating one or multiple welding positioning devices; the second zone comprises shielding parts and opening parts which are uniformly arranged at intervals in a parallel manner, the side, facing to the substrate, of each shielding part is provided with first grooves, and each groove is parallel to the opening parts in the longitudinal direction or in the transverse direction. The invention also discloses a preparation method of the mask plate on which the first grooves and the second grove are arranged, and a wet-process etching method is employed. The mask plate has the advantages of light mass, good strength, reduced substrate damages and the like.

Description

technical field [0001] The invention relates to a mask, especially a mask structure for vacuum evaporation Background technique [0002] In some semiconductor manufacturing processes, a vapor deposition step is required in order to deposit a substance (organic or inorganic) onto a substrate. In some processes, substances must be deposited in precisely defined areas on the substrate. To simplify the deposition process, a mask is usually applied to one side of the substrate, with cutouts or openings in the mask defining the areas where the species is deposited. It is often desirable to deposit material precisely into the regions corresponding to the openings so that the boundaries of these regions are well defined. For example, during the manufacture of Organic Light Emitting Diodes intended for display or other light emitting applications, organic substances must be deposited in precisely defined areas. [0003] State-of-the-art masks such as figure 1 , figure 2 ,and ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C23C14/04C23C16/04
Inventor 毕德锋叶添昇
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com