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51results about How to "Reduce sag" patented technology

Method for constructing copper wire on wafer and chemical mechanical polishing (CMP) method for copper

The invention discloses a method for constructing a copper wire on a wafer, which comprises the following steps of: depositing a first interlayer dielectric on the upper surface of the wafer; constructing a second interlayer dielectric on the upper surface of the first interlayer dielectric of the wafer, wherein the hardness of the second interlayer dielectric is lower than that of the first interlayer dielectric; photoetching the second interlayer dielectric and the first interlayer dielectric to define a groove structure, wherein the bottom of the groove structure is positioned in the first interlayer dielectric; sequentially depositing a barrier layer and a copper seed crystal layer on the upper surface of the wafer and the inner wall of a groove; depositing copper on the upper surface of the wafer, wherein the copper is filled in the groove to form the copper wire; and performing chemical mechanical polishing (CMP) on the wafer to reach the first interlayer dielectric so as to make the upper surface of the wafer subjected to planarization. The invention also discloses a CMP method for the copper. The sinking degree of the surface of the copper wire constructed by the scheme of the invention is reduced to a certain extent compared with that of the prior art.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1

Compositions for chemical-mechanical planarization of noble-metal-featured substrates, associated methods, and substrates produced by such methods

InactiveUS20090255903A1Erosion of and avoided and minimizedMaterial avoided and minimizedDecorative surface effectsSemiconductor/solid-state device manufacturingAlloySlurry
A composition for chemical-mechanical planarization comprises periodic acid and an abrasive present in a combined amount sufficient to planarize a substrate surface having a feature thereon comprising a noble metal, noble metal alloy, noble metal oxide, or any combination thereof. In one embodiment, the periodic acid is present in an amount in a range of from about 0.05 to about 0.3 moles / kilogram, and the abrasive is present in an amount in a range of from about 0.2 to about 6 weight percent. In another embodiment, the composition further comprises a pH-adjusting agent present in an amount sufficient to cause the pH of the composition to be in a range of from about pH 5 to about pH 10, or of from about pH 1 to about pH 4.A method for planarizing a substrate surface having a feature thereon comprising at least one noble metal, noble metal alloy, or noble metal oxide, or a combination thereof, comprises providing a composition or slurry comprising periodic acid and an abrasive in a combined amount sufficient to planarize the substrate surface, and polishing the surface with the slurry. A substrate produced by such a method is also provided.
Owner:VERSUM MATERIALS US LLC

Energy-saving conveying device based on reduction of friction force

The invention provides an energy-saving conveying device based on reduction of friction force. The energy-saving conveying device comprises two supporting side plates for supporting equipment, a supporting plate for connecting the two supporting side plates, a double-row conveying mechanism for conveying objects and an air-pressure progressive balance mechanism for reducing surface indentation friction force. The two supporting side plates are distributed in parallel, and a supporting plate is fixedly connected between the two supporting side plates. The invention relates to the field of conveying devices. According to the energy-saving conveying device based on reduction of the friction force, a special conveying mechanism and a special supporting structure are designed for solving the problem that an existing conveying crawler belt is too heavy and sunken in use. The sunken surface is reduced by strengthening the supporting force, and therefore the problems are effectively solved that when a common conveying device conveys large objects, surface indentation occurs, the friction resistance is large when the conveying belt makes contact with the shaft face of a conveying shaft, thedriving energy consumption is increased, the conveying belt is prone to being damaged, and limitations exist in most existing processing modes.
Owner:杨磊

Aramid fiber laid fabric as well as preparation method and application thereof

ActiveCN101892558BImprove ballistic resistanceImprove the appearance quality of cloth samplesFibre typesNon-woven fabricsAdhesiveAqueous solution
The invention provides an aramid fiber laid fabric which is prepared from aramid fibers through processes of filament expanding, gluing and drying. In the gluing process, the used composite glue solution contains an adhesive and a curing agent, and the adhesion and the creep resistance between the adhesive and the aramid fibers can be improved due to the addition of the curing agent to effectively passivate impact force of bullets, so that the aramid fiber laid fabric has higher impact-resistant performance. The mass ratio of the adhesive water solution and the curing agent in the composite glue solution is 100:0.2-2, and the mass ratio of the curing agent, preferentially aziridine curing agent, to the adhesive water solution is 0.5-1.0:100. In the invention, the composite glue solution further contains a defoaming agent for improving the surface morphology of a fabric swatch. The invention simultaneously improves the preparation method of the aramid fiber laid fabric to increase the production efficiency by over 25 percent. A shooting test shows that the elasticity-resistant performance of the laminated laid fabric can be improved by about 20 percent by adopting the technical scheme of the invention.
Owner:BEIJING AEROSPACE RATE MECHANICAL & ELECTRICAL ENG CO LTD

Steel pipe paint spraying processing equipment

The invention discloses steel pipe paint spraying processing equipment. The equipment structurally comprises a machine body, a bearing shaft, a paint spraying device and a paint storage box, the two ends of the bearing shaft are movably clamped to the two sides of the top end of the machine body, the bottom end of the paint spraying device is welded to the center of the top end of the machine body, the bottom end of the paint storage box is connected into the top end of the paint spraying device in an embedded mode, the paint spraying device comprises a shell, a limiting ring, a paint spraying block, a pushing block and a clamping device, the bottom end of the paint spraying block is connected to the center of the bottom end of the interior of the shell in an embedded mode, and the bottom end of the clamping device is movably matched with the top end of the pushing block. After a steel pipe is conveyed and guided into the paint spraying device through the bearing shaft, the steel pipe continues to move to the paint spraying block under limiting of the limiting ring, and is sent out by the clamping device after being subjected to paint spraying treatment, when a clamping block of the clamping device makes contact with the steel pipe, the upper end of a bearing column in the clamping device is pressed and then deforms, the contact area is increased, the contact pressure intensity is reduced, and the situation that the painted steel pipe is sunken after being clamped, and the sunken position is damaged too early during use is avoided.
Owner:磐石铸诚无缝钢管有限公司

Auxiliary supporting device for machine tool beam screw rod

InactiveCN104647109AAdd auxiliary support pointsReduce sagFeeding apparatusMetal working apparatusEngineeringSlide plate
The invention discloses an auxiliary supporting device for a machine tool beam screw rod and relates to the technical field of machinery manufacturing. The auxiliary supporting device is installed between a machine tool transverse sliding plate and a beam. A fixing support is arranged on the machine tool beam. A movable bracket is connected on the fixing support in a pressing mode and provided with a supporting block which is used for supporting the screw rod. The fixing support is provided with a horizontal first through hole, wherein the first through hole is sequentially provided with a spring, a pin and a bearing. One end, close to the spring, of the first through hole is provided with a sealing plate. The movable bracket is provided with a second through hole. The bearing is arranged in the first through hole of the fixing support and the second through hole of the movable bracket. A lifting pin is arranged in the second through hole. One side of the second through hole is provided with a third through hole. The third through hole is provided with a shaft and a bearing, wherein the bearing abuts against a guiding plate which is provided with a guiding groove, and the bearing extends into the guiding groove of the guiding plate. The auxiliary supporting device for the machine tool beam screw rod can solve the problems that the supporting device for the heavy machine tool beam screw rod is complex in structure and high in production cost and can only support partial drooping screw rods.
Owner:柳州金盛重型数控机床有限责任公司

Method for constructing copper wire on wafer and chemical mechanical polishing (CMP) method for copper

The invention discloses a method for constructing a copper wire on a wafer, which comprises the following steps of: depositing a first interlayer dielectric on the upper surface of the wafer; constructing a second interlayer dielectric on the upper surface of the first interlayer dielectric of the wafer, wherein the hardness of the second interlayer dielectric is lower than that of the first interlayer dielectric; photoetching the second interlayer dielectric and the first interlayer dielectric to define a groove structure, wherein the bottom of the groove structure is positioned in the firstinterlayer dielectric; sequentially depositing a barrier layer and a copper seed crystal layer on the upper surface of the wafer and the inner wall of a groove; depositing copper on the upper surfaceof the wafer, wherein the copper is filled in the groove to form the copper wire; and performing chemical mechanical polishing (CMP) on the wafer to reach the first interlayer dielectric so as to make the upper surface of the wafer subjected to planarization. The invention also discloses a CMP method for the copper. The sinking degree of the surface of the copper wire constructed by the scheme ofthe invention is reduced to a certain extent compared with that of the prior art.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1
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