A uniform electrochemical treatment method for the inner surface of a tubular workpiece
A processing method and electrochemical technology, applied in the field of electrochemistry, can solve the problems of inability to prepare a coating with uniform thickness or uniform electrochemical treatment, so as to achieve good uniformity and improve the effect of uniformity
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Embodiment 1
[0065] Such as figure 1 As shown, the copper anodes are placed at the mouths of both ends of the pipeline, and the parameters are set according to Table 1 for simulation calculation.
[0066] figure 1 It is the calculation model figure of embodiment 1, figure 2 It is the current density distribution figure of embodiment 1, image 3 It is the normalized current density distribution diagram obtained by simulation calculation in Example 1. figure 1 In the middle, the middle part is a pipe, and the two sides are copper anodes.
[0067] As can be seen from the calculation results of Example 1, the electroplating anode is placed at the two ports of the pipeline, and the current density distribution is mainly concentrated at the mouth of the pipeline. The farther the distance from the mouth is, the smaller the current density is. The current density on the inner surface tends to zero. The normalized current density distribution is between 0 and 1. The normalized current density...
Embodiment 2
[0069] A copper rod with a length of 22cm and a diameter of 10mm is inserted into the pipeline as an anode, and the simulation calculation is carried out according to the set parameters.
[0070] Figure 4 It is the calculation model figure of embodiment 2, Figure 5 It is the current density distribution figure of embodiment 2, Figure 6 It is the normalized current density distribution diagram obtained by simulation calculation in Example 2.
[0071] From the calculation results of Example 2, it can be seen that after the electroplating anode is inserted into the pipeline, the current density distribution on the inner surface of the pipeline is significantly improved compared with Example 1, but the current density at the mouth of the electroplating pipeline is still quite different from that in the middle of the pipeline. When the current density is distributed between 0.63 and 1, the uniformity of the coating thickness distribution is still poor.
Embodiment 3
[0073] A copper rod with a length of 2cm and a diameter of 10mm is inserted into the pipe as an anode, and is scanned and moved up and down along the axis of the target pipe at a constant speed at a constant speed, and the simulation calculation is carried out according to the set parameters.
[0074] Figure 7 It is the calculation model figure of embodiment 3, Figure 8 It is the current density distribution figure of embodiment 3, Figure 9 It is the normalized current density distribution diagram obtained by simulation calculation in Example 3.
[0075] From the calculation results of Example 3, it can be seen that during the uniform scanning motion of the anode reciprocating up and down along the axis in the pipeline, the instantaneous current density distribution in the pipeline changes with the change of the position of the anode, although the instantaneous current density distribution on the inner surface of the pipeline is not uniform , but after the superposition o...
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