Electroplating system and electroplating method for surface-mounted light emitting diode support
A light-emitting diode, mount-type technology, applied in the direction of circuits, semiconductor devices, etc., can solve problems such as low production efficiency, time-consuming cost, complex equipment process, etc., achieve good electrical and thermal conductivity, improve plating efficiency, and improve plating quality Effect
Active Publication Date: 2014-12-17
崇辉半导体(深圳)有限公司
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Problems solved by technology
However, the existing electroplating process for silver plating on the chip functional area of the surface mount type LED bracket usually adopts a double-sided silver plating process and simultaneously performs double-sided silver plating on the chip functional area of the LED bracket at one time, that is, the LED The silver-plated layer on both sides of the chip functional area of the bracket is formed by electroplating in the same electroplating step, so that the two sides of the chip functional area of the LED bracket can only form silver-plated layers with the same thickness
When the two sides of the chip functional area of the LED bracket need to be plated with different thicknesses of silver plating, the process of silver plating on one side can only be repeated again. In this way, on the one hand, the equipment process is complicated, time-consuming and costly. , leading to increased production costs and low production efficiency of surface mount LED products; on the other hand, resulting in poor quality of the silver plating layer, which directly affects the performance of surface mount LED products
Therefore, the existing electroplating process of surface-mounted LED brackets can no longer meet the needs of electroplating surface-mounted LED brackets
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[0016] In order to further explain the technical means and effects that the present invention takes to achieve the intended purpose of the invention, below in conjunction with the accompanying drawings and preferred embodiments, the electroplating method and electroplating system of the surface-mounted light-emitting diode bracket proposed according to the present invention are specifically described. Embodiment, structure, feature and effect thereof are described in detail as follows:
[0017] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. Through the description of specific embodiments, the technical means and effects of the present invention to achieve the intended purpose can be understood more deeply and specifically. However, the attached drawings are only for reference and description, and are not used to...
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The electroplating system of the surface-mounted light-emitting diode bracket of the present invention includes a feeding device, a receiving device, and an electroplating pretreatment device, an electroplating copper device, an electroplating nickel device, and an electroplating silver device sequentially arranged between the feeding device and the receiving device And electroplating post-processing equipment. The feeding device and the receiving device roll up and convey the belt-shaped surface-mounted LED bracket with multiple chip functions through the electroplating pre-treatment device, electro-copper plating device, electro-nickel plating device, electro-silver plating device and electro-plating post-processing device. . The electro-silvering device includes a pre-silvering device, a first-selected silver-plating device, a second-selected silver-plating device and a silver-returning device. The first silver-plating device only silver-plates multiple second surfaces of multiple chip functional parts, and the second selective silver-plating step only silver-plates multiple first surfaces of multiple chip functional parts. The invention also relates to electroplating methods. The electroplating system and method have a simple technological process and are beneficial to improving electroplating efficiency, reducing costs and improving the quality of the plating layer.
Description
technical field [0001] The invention relates to the technical field of electroplating, and in particular to an electroplating system and an electroplating method for a surface-mounted light-emitting diode bracket. Background technique [0002] The manufacturing process of the existing surface-mounted light emitting diode (LED) is as follows: first, the metal sheet is punched and formed into a surface-mounted LED bracket, and then the formed surface-mounted LED bracket is electroplated. , slicing, packaging, injection molding, solid crystal, short-baking curing, wire bonding, dispensing, aging baking, tinning and other process steps to complete the surface mount of LED chips, and then make surface mount type after testing, sorting and packaging LED products. [0003] Among them, the electroplating step of the surface-mounted LED bracket is one of the key steps in the entire manufacturing process of the surface-mounted light-emitting diode. The electroplating of the surface ...
Claims
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IPC IPC(8): C25D7/12C25D5/02C25D5/12
Inventor 郑建国
Owner 崇辉半导体(深圳)有限公司