Electrogenerated chemical polishing method

Abstract

The invention provides an electrogenerated chemical polishing method which comprises the following steps: preparing a working solution which contains an electroactive mediator, a pH regulating agent, a viscosity regulating agent and an inhibiting agent; parallelly and oppositely arranging the working surface of a working electrode and the surface of a workpiece, wherein the working surface of the working electrode has smoothness less than 1 micrometer; and immersing the working surface of the working electrode and the surface of the workpiece into the working solution, and regulating the spacing between the working surface of the working electrode and the surface of the workpiece to 0.05-20 micrometers through a micro-nano composite feeding mechanism. According to the method, a power supply is started to electrify the working electrode and an auxiliary electrode, the electroactive mediator near the working surface of the working electrode generates an etching agent through electrochemical reaction, and a local high point positioned on the surface of the workpiece is selectively etched in such a way that the etching agent is dispersed to the surface of the workpiece and generates diffusion controlled etching reaction, so that the unstressed polishing on the surface of the workpiece is realized.

Description

technical field [0001] The invention relates to polishing technology, in particular to an electrochemical polishing method. Background technique [0002] When manufacturing high-performance and high-precision electronic devices or optical components, it is required to perform ultra-precision polishing on the surface of these devices and components to obtain an ultra-smooth, defect-free and stress-free surface. In traditional ultra-precision machining, although cutting, grinding, and polishing can obtain ultra-smooth surfaces and have high processing efficiency, these processing methods mainly remove materials through the mechanical action of tools or abrasives on the workpiece surface. , prone to microscopic defects such as scratches, dislocations, phase transitions, and residual stresses. Therefore, it is difficult to obtain ultra-smooth, defect-free and stress-free workpiece surfaces by ultra-precision machining methods that achieve material removal through mechanical act...

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Problems solved by technology

[0005] The purpose of the present invention is to aim at the above-mentioned prior art that requires extremely high precision of the tool electrode precision and the distance control precision between the electrode and the workpiece surface, and when the working surface of the tool electrode is large, due to the scavenger in the large-area micro-nano gap Due to the difficulty of replenishment, the etching and leveling agent liquid layer is not easy to be compressed to the nanometer level, and the selective removal ability of the material is reduced. stress polishing

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