LED lamp and manufacturing method thereof

A technology of LED lamps and LED light sources, applied in cooling/heating devices of lighting devices, lighting and heating equipment, point light sources, etc., can solve the problems of large investment in molds, complicated lamp body processing technology, and the weight of the whole lamp, etc., to achieve Less investment in equipment and molds, easy mass production, and simple processing technology

Inactive Publication Date: 2014-07-16
深圳市阳光富源科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In order to achieve the LED heat dissipation effect, the heat dissipation substrate of the lamp is either made relatively bulky, or the structural design is relatively complicated. In this way, for large-sca

Method used

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  • LED lamp and manufacturing method thereof
  • LED lamp and manufacturing method thereof
  • LED lamp and manufacturing method thereof

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Embodiment Construction

[0034] The present invention will be described in further detail below in conjunction with accompanying drawing:

[0035] see Figure 1 ~ Figure 3 As shown, the LED lamp includes a light source module 1, a heat sink 2 and a power supply assembly 3, wherein: the outer surface of the heat sink 2 is connected to the light source module 1, and the inner surface of the heat sink 2 is connected to the light source module 1 through the connection assembly 4. Connected to the light pole fixing component 5, the light source module 1, heat sink 2 and power supply component 3 are encapsulated by a sealing material to form a sealed space.

[0036] In this embodiment, the heat sink 2 is formed by U-shaped frame 21, a plurality of parallel L-shaped cooling fins 22 punched and stretched at the corners of U-shaped frame 21, and the L-shaped cooling fins 22 are stretched on the U-shaped frame. It is composed of several cooling grooves 23 formed on the frame 21 and connected with the outside w...

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Abstract

The invention relates to an LED lamp and a manufacturing method of the LED lamp. According to the LED lamp, the outer surface of a radiator is connected with a light source module, the light source module is connected to a lamp pole fixing assembly on the inner surface of the radiator through a connecting assembly, and the light source module, the radiator and a power source assembly are packaged through a sealing material. The manufacturing method comprises the steps that an aluminum substrate is processed through cutting and punching to form a U-shaped frame with a plurality of parallel L-shaped cooling fins, the cooling fins are stretched, and then a plurality of cooling grooves which are communicated with the outside world are formed in the U-shaped frame; LED light sources and back sealing supports are connected to the corresponding portions of the inner plane and the corresponding portions of the outer plane of the U-shaped frame of the radiator respectively; the positive electrodes and the negative electrodes of the LED light sources are connected with PCBs in a welding mode through connecting contact pins, so that the LED light sources are connected in series and in parallel; sealing spaces of the back sealing supports located among the light source module, the PCBs and the radiator are filled with sealants; the light source module and the radiator are connected to the lamp pole fixing assembly through the connecting assembly.

Description

technical field [0001] The invention relates to an LED lamp and a manufacturing method thereof. Background technique [0002] For existing LED lamps, heat dissipation design is a major bottleneck. At present, die-cast heat dissipation substrates, profile heat dissipation substrates, and sheet heat dissipation substrates are more common in the market. In order to achieve the LED heat dissipation effect, the heat dissipation substrate of the lamp is either made relatively bulky, or the structural design is relatively complicated. In this way, for large-scale lamps, such as street lamps, the whole lamp is heavy, and the processing technology of the lamp body is also relatively complicated. The investment is large, and the after-sales maintenance in the market is more difficult. Contents of the invention [0003] The purpose of the present invention is to provide an aluminum plate that uses the CN201110025152.3 "shear-drawn plate-type LED lamp heat sink" to add quantum contro...

Claims

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Application Information

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IPC IPC(8): F21S8/00F21V29/00F21V31/00F21V23/00F21Y101/02F21V29/503F21V29/74F21V29/83
Inventor 刘兆辉田建涂阳球
Owner 深圳市阳光富源科技有限公司
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