LED lamp and manufacturing method thereof

Abstract

The invention relates to an LED lamp and a manufacturing method of the LED lamp. According to the LED lamp, the outer surface of a radiator is connected with a light source module, the light source module is connected to a lamp pole fixing assembly on the inner surface of the radiator through a connecting assembly, and the light source module, the radiator and a power source assembly are packaged through a sealing material. The manufacturing method comprises the steps that an aluminum substrate is processed through cutting and punching to form a U-shaped frame with a plurality of parallel L-shaped cooling fins, the cooling fins are stretched, and then a plurality of cooling grooves which are communicated with the outside world are formed in the U-shaped frame; LED light sources and back sealing supports are connected to the corresponding portions of the inner plane and the corresponding portions of the outer plane of the U-shaped frame of the radiator respectively; the positive electrodes and the negative electrodes of the LED light sources are connected with PCBs in a welding mode through connecting contact pins, so that the LED light sources are connected in series and in parallel; sealing spaces of the back sealing supports located among the light source module, the PCBs and the radiator are filled with sealants; the light source module and the radiator are connected to the lamp pole fixing assembly through the connecting assembly.

Description

technical field [0001] The invention relates to an LED lamp and a manufacturing method thereof. Background technique [0002] For existing LED lamps, heat dissipation design is a major bottleneck. At present, die-cast heat dissipation substrates, profile heat dissipation substrates, and sheet heat dissipation substrates are more common in the market. In order to achieve the LED heat dissipation effect, the heat dissipation substrate of the lamp is either made relatively bulky, or the structural design is relatively complicated. In this way, for large-scale lamps, such as street lamps, the whole lamp is heavy, and the processing technology of the lamp body is also relatively complicated. The investment is large, and the after-sales maintenance in the market is more difficult. Contents of the invention [0003] The purpose of the present invention is to provide an aluminum plate that uses the CN201110025152.3 "shear-drawn plate-type LED lamp heat sink" to add quantum contro...

AI Technical Summary

Problems solved by technology

In order to achieve the LED heat dissipation effect, the heat dissipation substrate of the lamp is either made relatively bulky, or the structural design is relatively complicated. In this way, for large-scale lamps, such as street lamps, the whole lamp is heavy, and the processing technology of the lamp body is also relatively complicated. Large investment, difficult after-sales maintenance in the market, etc.

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