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Anti-overload non-silicon MEMS thick metal suspended micro inductor

A thick metal, anti-overload technology, applied in the field of MEMS technology, can solve the problems of poor reliability of suspended metal spiral coils, achieve the effect of high process reliability and yield, simple and easy process, and reduce loss factors

Inactive Publication Date: 2014-07-16
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] Secondly, in order to solve the problem of poor reliability of the suspended metal spiral coil, a support column is added under the coil

Method used

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  • Anti-overload non-silicon MEMS thick metal suspended micro inductor
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  • Anti-overload non-silicon MEMS thick metal suspended micro inductor

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Embodiment Construction

[0037] Below in conjunction with accompanying drawing, the embodiment of the present invention is described in detail, present embodiment implements under the premise of technical solution of the present invention, has provided detailed implementation scheme and specific operation process, but protection scope of the present invention is not limited to the following the described embodiment.

[0038] Such as figure 1 and figure 2 As shown, this embodiment is composed of a substrate, an electrical connection column 2 , a support body column 3 and a suspended metal helical coil 4 . The electrical connection column 2 is made on the electrical connection port 5 of the substrate, and the other end is connected with the suspended metal helical coil 4 . One end of the supporting column 3 is connected with the suspended metal spiral coil 4, and the other end is connected with the passivation layer 1 of the substrate.

[0039] The substrate includes a substrate 6 with circuits and ...

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Abstract

The invention discloses an anti-overload non-silicon MEMS thick metal suspended micro inductor. The suspension height of the MEMS suspended micro inductor is 20 microns, the thickness of a metal layer of a suspended metal spiral coil is 20 microns, and a supporting column arranged on the diagonal portion of the coil is additionally arranged between the suspended metal spiral coil and a substrate to improve the anti-overload capacity of the coil. The manufacturing process includes the steps that the substrate is cleaned and processed; the front side of the substrate is glued, Cr is applied to the back side of the substrate in a sputtering mode, the back side of the substrate is subjected to gluing, exposure, developing and corrosion, and an overlay alignment mark is manufactured; glue removing, sputtering, gluing, exposure, developing and Cu electroforming are carried out; sputtering, gluing, photoetching, developing and Cu electroforming are carried out; photoresists and seed layers are removed. The MEMS suspended micro inductor has excellent radio frequency performance and strong anti-overload capacity, polishing is not needed in the technical process, the technical process is simple, and the rate of finished products is high.

Description

technical field [0001] The invention relates to a method for designing and manufacturing an anti-overload non-silicon MEMS thick metal suspension micro-inductor, which belongs to the technical field of MEMS technology. Background technique [0002] Inductors are one of the important passive components of radio frequency circuits. With the development of RF MEMS technology, some inductors made with MEMS technology have been published in public reports. Better radio frequency performance, among which the Q value of MEMS suspended micro-inductor with suspended metal spiral coil structure is the highest, which can improve the performance of radio frequency integrated circuits very well. [0003] The key parameters of the MEMS suspended micro-inductor are mainly the suspension height of the coil and the metal thickness of the coil. The suspension height of the coil determines the suppression effect on the substrate loss, and the metal thickness of the coil determines the size of ...

Claims

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Application Information

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IPC IPC(8): H01L23/522H01L21/02
Inventor 李建华徐立新付博卢冲赢韩琦郭旭红陈和峰包艳萍李慧娟武浩贾瑾李月
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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