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Laminated backing plate for drilling and preparation method thereof

A technology of backing plate and phenolic resin, which is applied in the field of laminated backing plate for drilling and its preparation, can solve the problem that the backing plate for drilling cannot meet the requirements of small-diameter drilling and reduce costs at the same time, and achieve low cost and high cost. Market competitiveness and the effect of quality improvement

Active Publication Date: 2016-04-27
SHENZHEN NEWCCESS IND
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Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a laminated backing plate for drilling and its preparation method, aiming to solve the problem that the current backing plate for PCB drilling cannot simultaneously meet the requirements of small-diameter drilling and reduce costs. question

Method used

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  • Laminated backing plate for drilling and preparation method thereof

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Embodiment Construction

[0015] The present invention provides a laminated backing plate for drilling and a preparation method thereof. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0016] The invention provides a method for preparing a laminated backing plate for drilling, the method is as follows: the laminated backing plate for drilling is made of wood pulp paper impregnated with phenolic resin and kraft paper impregnated with urea-formaldehyde resin or modified urea-formaldehyde resin. The inner paper is laminated and pressed.

[0017] When the PCB is drilled, the drilling depth layer of the drilling needle on the backing plate of the present invention is thermally stable, low in moisture absorption, and suitable for flexi...

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Abstract

The invention discloses a laminating base plate for boring and a preparing method thereof. The preparing method comprises the step that the laminating base plate for boring is formed by laminating and pressing surface paper and inside paper, wherein the surface paper is formed by soaking wood pulp paper with phenolic resin and the inside paper is formed by soaking brown paper soaked with urea resin or modified urea resin. The surface paper used by the base plate for boring and having well waterproofness can prevent the warping abnormity of the base plate caused by the temperature and humidity change of the environment and the flatness of the base plate is ensured; in addition, chip removal is not affected due to heating and adhesion in the small-aperture boring process of the base plate and the hole wall quality of a boring hole is improved. The attribution of the material of the base plate is superior to that of the urea resin and is close to that of a phenolic aldehyde base plate, and the cost of the base plate is lower than that of the phenolic aldehyde base plate, so the laminating base plate for boring has higher competitiveness.

Description

technical field [0001] The invention relates to the field of PCB processing and manufacturing, in particular to a laminated backing plate for drilling and a preparation method thereof. Background technique [0002] Printed circuit boards (referred to as PCBs) are divided into rigid printed circuit boards, flexible printed circuit boards and rigid-flexible boards. Backing boards for drilling printed circuit boards are currently generally used in fiberboards, sticker wood fiber boards, melamine wood backing boards, phenolic paper backing boards, etc. Among them, fiberboard and sticker wood fiberboard are mainly used for drilling of medium and high-grade circuit boards, and phenolic boards are used for drilling of high-grade circuit boards and flexible circuit boards. With the rapid development of electronic technology, modern electronic products have become smaller and smaller, and their functions have become more and more complex. The printed circuit board (PCB) that support...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B29/00B32B29/06B26F1/00B26D7/00D21H17/48D21H17/57
Inventor 程小波杨柳杨迪
Owner SHENZHEN NEWCCESS IND
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