Cleaning control method of particulate matters on probes of probe card

A control method and particle technology, which is applied to the components of electrical measuring instruments, measuring devices, instruments, etc., can solve the problems that affect the accuracy of contact resistance detection, test PAD and metal wire short circuit, and device burnout, etc.

Active Publication Date: 2014-08-06
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Abstract
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  • Application Information

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Problems solved by technology

In this case, if the tip of the probe is contaminated with particles, it will not only affect the detection accuracy of the contact resistance during the test, but also, because the distance between the test PAD and th

Method used

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  • Cleaning control method of particulate matters on probes of probe card

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Embodiment Construction

[0029] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0030] In this example, please refer to figure 1 , figure 1 It is a control flow chart of a particle cleaning control method of a probe card probe of the present invention. As shown in the figure, the particle cleaning control method of the probe card probe of the present invention is implemented through the following steps:

[0031] Step S01: Set the inspection cycle for particle contamination. The inspection cycle of the particle contamination of the probe is set in the probe card machine, and the inspection cycle is set to perform the inspection of the particulate contamination of the probe after the electrical test of each wafer is completed.

[0032] Step S02: Start wafer test. According to the inspection cycle, the electrical test of each wafer is started.

[0033] Step S03: complete the wafer test. Complete the electrical test on...

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Abstract

The invention discloses a cleaning control method of particulate matters on probes of a probe card. The method comprises the steps of after the electrical performance test of each piece of wafer is carried out and the probes are cleaned each time, respectively carrying out particulate matter contamination check on the probes by comparing the optical images of the points of the adjacent probes one by one, judging whether the probes need to be cleaned or cleaned again according to the results of the check, and carrying out corresponding treatment; limiting the allowed number of cleaning again, and adopting the measures of alarming and stopping a machine in time to control the effect of repeatedly cleaning; therefore, the particulate matters contaminating the probes can be cleaned in time, the phenomenon of blindly cleaning the probes is avoided, and the serious consequences that the test results have errors and even a device is burnt out caused by the fact that the probes which are contaminated by the particulate matters are continuously applied to the electrical performance test of the wafer due to the lack of probe cleaning effect detection can be avoided; the method can be used for effectively controlling the cleaning period and the cleaning effect of the probes of a probe card machine.

Description

Technical field [0001] The invention relates to a cleaning technology for a probe card used for wafer acceptance testing in the field of semiconductor microelectronic testing, and more specifically, to a control method for cleaning the probes of the probe card when particles are cleaned. Background technique [0002] After the semiconductor wafer is fabricated and before packaging, in order to ensure the yield of the wafer and avoid packaging waste, a wafer acceptance test (WAT) is required in the semiconductor manufacturing process. The WAT probe card machine is widely used for electrical testing of wafers and is a test interface between WAT measuring instruments and wafers. Its working principle is to directly contact the probe of the probe card connected to the measuring instrument with the test pad (PAD) or bump electrode on the chip to be tested to form a measurement loop, and feed the test signal and Feedback chip signals, and then cooperate with measuring instruments and ...

Claims

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Application Information

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IPC IPC(8): G01N21/94G01R1/073
Inventor 李雨凡莫保章
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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