Cleaning control method of particulate matters on probes of probe card

Abstract

The invention discloses a cleaning control method of particulate matters on probes of a probe card. The method comprises the steps of after the electrical performance test of each piece of wafer is carried out and the probes are cleaned each time, respectively carrying out particulate matter contamination check on the probes by comparing the optical images of the points of the adjacent probes one by one, judging whether the probes need to be cleaned or cleaned again according to the results of the check, and carrying out corresponding treatment; limiting the allowed number of cleaning again, and adopting the measures of alarming and stopping a machine in time to control the effect of repeatedly cleaning; therefore, the particulate matters contaminating the probes can be cleaned in time, the phenomenon of blindly cleaning the probes is avoided, and the serious consequences that the test results have errors and even a device is burnt out caused by the fact that the probes which are contaminated by the particulate matters are continuously applied to the electrical performance test of the wafer due to the lack of probe cleaning effect detection can be avoided; the method can be used for effectively controlling the cleaning period and the cleaning effect of the probes of a probe card machine.

Description

Technical field [0001] The invention relates to a cleaning technology for a probe card used for wafer acceptance testing in the field of semiconductor microelectronic testing, and more specifically, to a control method for cleaning the probes of the probe card when particles are cleaned. Background technique [0002] After the semiconductor wafer is fabricated and before packaging, in order to ensure the yield of the wafer and avoid packaging waste, a wafer acceptance test (WAT) is required in the semiconductor manufacturing process. The WAT probe card machine is widely used for electrical testing of wafers and is a test interface between WAT measuring instruments and wafers. Its working principle is to directly contact the probe of the probe card connected to the measuring instrument with the test pad (PAD) or bump electrode on the chip to be tested to form a measurement loop, and feed the test signal and Feedback chip signals, and then cooperate with measuring instruments and ...

AI Technical Summary

Problems solved by technology

In this case, if the tip of the probe is contaminated with particles, it will not only affect the detection accuracy of the contact resistance during the test, but also, because the distance between the test PAD and the metal wire of the chip is extremely small (about 2 μm), Probes contaminated with particles will cause a short circuit between the test PAD and the metal wire, resulting in serious consequences such as device burnout

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