Cladding mold suitable for high-molecular material to clad computer upper housing body

Abstract

The invention discloses a cladding mold suitable for a high-molecular material to clad a computer upper housing body. The cladding mold comprises an upper mold and a lower mold; a lower accommodating region for holding a to-be-cladded computer upper housing body and a lower molding cavity for molding the high-molecular material are formed in the lower mold; an upper accommodating region cooperating with the lower accommodating region and an upper molding cavity cooperating with the lower molding cavity are formed in the upper mold; the upper surface of the lower mold is provided with a plurality of feeding inlets, and the feeding inlets are communicated with the lower molding cavity through runners provided for the molten high-molecular material to pass through. The cladding mold has the beneficial effects that the cladding mold is suitable for making the high-molecular material clad the computer upper housing body, a product obtained from molding has the advantages of good metal material strength, radiation resistance and light weight, the high-molecular material is used at routing positions, and signal receiving is ensured not to be interfered; and with combination of the advantages of the two materials, the high-molecular material is fed by multiple points, the appearance is ensured to be perfect after molding, no gap exists at joints, the high-molecular material does not fall off, and the quality of the product is ensured.

Description

technical field [0001] The invention relates to a mold, in particular to a coating mold suitable for coating polymer materials on metal parts. Background technique [0002] With the development of the high-end notebook market, some new materials such as magnesium alloy, titanium alloy and other metal notebooks are more and more popular with consumers because of their excellent texture and durability. Magnesium alloy and titanium alloy are especially suitable for making notebooks. The upper shell has the advantages of good strength, radiation resistance, and light weight. The manufactured products have a beautiful appearance. However, the disadvantage is that such metal materials will interfere with the signals of electronic products. Therefore, non-metallic materials must be used in the wiring position. components to improve the overall performance of the product. In view of this, it is urgent to develop a corresponding overmold. Contents of the invention [0003] In ord...

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Problems solved by technology

[0002] With the development of the high-end notebook market, some new materials such as magnesium alloy, titanium alloy and other metal notebooks are more and more popular with consumers because of their excellent texture and durability. Magnesium alloy and titanium alloy are especially suitable for making notebooks. The upper shell has the advantages of good strength, radiation resistance, and light weight. The manufactured products have a beautiful appearance. However, the disadvantage is that such metal materials will interfere with the signals of electronic products. Therefore, non-metallic materials must be used in the wiring position. components to improve the overall performance of the product

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