Cu-Ni-Si Based Copper Alloy Sheet Having High Die Abrasion Resistance And Good Shear Processability And Method For Producing Same
A cu-ni-si, copper alloy plate technology, used in printed circuit manufacturing, metal/alloy conductors, cable/conductor manufacturing, etc., can solve problems such as insufficient research, and achieve excellent mold wear resistance and shear Processability, maintenance of tensile strength and electrical conductivity, and effect of improving die wear resistance
Active Publication Date: 2014-08-27
MITSUBISHI SHINDOH CO LTD
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Problems solved by technology
[0013] Cu-Ni-Si-based copper alloy sheets disclosed in conventional technical documents are excellent in bending workability, yield strength relaxation, or shearing workability, but they have excellent mold resistance while maintaining tensile strength and electrical conductivity. Cu-Ni-Si-based copper alloy sheets with abrasiveness and shear workability have not been fully studied
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[0079] The materials were blended so that the components shown in Table 1 were melted in a low-frequency melting furnace with a reducing atmosphere, and then cast to produce a copper alloy ingot with a thickness of 80 mm, a width of 200 mm, and a length of 800 mm. After heating the copper alloy ingot to 900-980° C., as shown in Table 1, hot rolling was performed by changing the cooling start temperature after the final pass of hot rolling to produce a hot-rolled sheet with a thickness of 11 mm. After the hot-rolled sheet was water-cooled, both surfaces were face-cut by 0.5 mm. Next, after cold rolling at a reduction rate of 87% to produce a cold-rolled sheet, continuous annealing at 710 to 750° C. for 7 to 15 seconds was carried out, followed by pickling and surface grinding, and as shown in Table 1, changing Cold rolling was performed at an average rolling rate and a total rolling rate of one pass to produce a cold-rolled sheet having a thickness of 0.3 mm.
[0080] As shown...
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Abstract
A Cu-Ni-Si based copper alloy sheet which has an excellent die abrasion resistance and a good shear processability while maintaining a sufficient strength and a sufficient conductivity, said Cu-Ni-Si based copper alloy sheet comprising 1.0-4.0 mass% of Ni, 0.2-0.9 mass% of Si and the balance consisting of Cu and unavoidable impurities, wherein the number of Ni-Si precipitate grains having a grain size of 20-80 nm present on the surface thereof is 1.5106 to 5.0106 / mm2 and the number of Ni-Si precipitate grains having a grain size exceeding 100 nm present on the surface thereof is 0.5105 to 4.0105 / mm2. In the Cu-Ni-Si based copper alloy sheet, the ratio a / b [wherein a stands for the number (grains / mm2) of Ni-Si precipitate grains having a grain size of 20-80 nm that are present in a surface layer extending from the surface to the depth corresponding to 20% of the thickness of the whole sheet; and b stands for the number (grains / mm2) of Ni-Si precipitate grains having a grain size of 20-80 nm that are present below the surface layer] is in the range of 0.5-1.5, and the concentration of Si solid-soluted in crystal grains present in an area at a depth of less than 10 mum from the surface is 0.03-0.4 mass%.
Description
technical field [0001] The invention relates to a Cu-Ni-Si copper alloy plate with good mold wear resistance and shear workability and a manufacturing method thereof. Background technique [0002] It is difficult for Cu-Ni-Si-based copper alloys to have high strength, high electrical conductivity, and excellent bending workability at the same time, but they usually have excellent various characteristics and are inexpensive, so in order to improve electrical connection characteristics, plating is performed on the surface It is widely used as conductive parts such as connectors for electrical connection of automobiles and connection terminals of printed circuit boards. Recently, not only high strength and high electrical conductivity are required, but also strict bending workability such as 90° bending after grooving is required. [0003] In addition, in order to ensure contact reliability in a high-temperature environment, electrical connectors used recently in the vicinity ...
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Login to View More IPC IPC(8): C22C9/06C22C9/04C22F1/08H01B1/02H01B5/02H01B13/00C22F1/00
CPCH01B13/00C22C9/06H01B1/026C22C9/04C22F1/00H05K3/00C22F1/08H01B5/02
Inventor 熊谷淳一阿部良雄齐藤晃梅津秀三饭野谅
Owner MITSUBISHI SHINDOH CO LTD