Double-sided copper disc grinding process for sapphire panel

Abstract

The invention discloses a double-sided copper disc grinding process for a sapphire panel. The double-sided copper disc grinding process comprises the first step of placing the sapphire product into a wandering star wheel mold cavity of a double-sided copper disc grinder and smearing grinding and cutting fluid on the upper surface and the lower surface of the sapphire product, wherein a tooth ring and a sun wheel of the double-sided copper disc grinder are respectively meshed with wheel teeth on the wandering star wheel, the second step of controlling an upper copper disc of the double-sided copper disc grinder to move downwards until the upper copper disc and a lower copper disc make contact with the upper surface and the lower surface of the sapphire product respectively, and the third step of performing pressurization on the upper copper disc and meanwhile controlling the upper copper disc and the lower copper disc to rotate reversely so that the upper surface and the lower surface of the sapphire product can be ground. According to the double-sided copper disc grinding process for the sapphire panel, the two surfaces of the sapphire panel are ground at a time, so that the machining time of the grinding process is shortened, the machining process steps are simplified, production cost is lowered, and production efficiency is enhanced; meanwhile, as the synthetic resin copper grinding discs are adopted for grinding, the grinding process has the advantages of high accuracy and high grinding efficiency, thereby enhancing the machining yield of the product.

Description

technical field [0001] The invention relates to a sapphire processing technology, in particular to a double-sided copper disk grinding technology for a sapphire panel. Background technique [0002] The existing sapphire industry all use the traditional single-side grinding process to process the thickness of the sapphire panel. The existing single-side processing process is inefficient, and the thickness difference of the 5 points on the surface is relatively large, and the sapphire sheet needs to be solidified before processing. The wax is pasted on the fixed ceramic plate. After processing, the sapphire piece needs to be pulled out from the ceramic plate at high temperature. Therefore, the processing technology of single-side grinding is complicated and the processing efficiency is low. The existence of sapphire leads to a large difference in the thickness of the surface after grinding the two sides, and the production defect rate is high. Even during processing, the sapph...

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a double-sided copper disc grinding process for sapphire panels, wh

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