A pcb design method for suppressing plane resonance

A design method and planar technology, applied in the electronic field, can solve the problems of increasing design cost and increasing the difficulty of PCB design, and achieve the effects of reducing design cost, reducing ground bounce effect, and avoiding electromagnetic radiation

Active Publication Date: 2017-08-25
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the method of adding decoupling capacitors will increase the design cost, and when the PCB design is getting more and more dense, adding capacitors will increase the difficulty of PCB design

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A pcb design method for suppressing plane resonance
  • A pcb design method for suppressing plane resonance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A PCB design method to suppress plane resonance In the design of printed circuit boards, the method of changing the plane cutting is used to change the cavity formed between the power layer and the ground layer (or the power layer and the power layer), thereby improving the frequency band we focus on. resonance.

Embodiment 2

[0022] On the basis of Embodiment 1, the method of changing the plane cutting described in this embodiment is that if a resonant frequency point with the same frequency as the signal in the wiring area appears in a certain area, the power layer adjacent to this area is hollowed out for design , the hollowed-out area has the same size as the resonance area.

Embodiment 3

[0024] On the basis of Embodiment 1 or 2, in this embodiment, the frequency point resonance distribution of the planar resonator can be viewed through the SIGRITY POWER SI simulation software.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a PCB design method for suppressing plane resonance. In the design of printed circuit boards, the method of changing the plane cutting is used to change the cavity formed between the power layer and the ground layer (or the power layer and the power layer), thereby improving We focus on the resonance of the frequency band. Adopting the technology of the present invention can reduce the ground bounce effect caused by plane intrinsic resonance. By changing the plane design method, we can avoid the resonance condition of the frequency band we pay attention to, avoid the resonance of the plane in the frequency band we care about, and avoid the electromagnetic interference caused by resonance. Emissions, signal integrity and power integrity issues.

Description

technical field [0001] The invention relates to the field of electronics, to PCB design software, to the field of SIGRITY POWER SI simulation software, and in particular to a PCB design method for suppressing plane resonance. [0002] technical background [0003] In the FPGA design process, due to the high density of electronic components on the PCB, the denser wiring, and the higher and higher signal frequencies, EMC (electromagnetic compatibility) and EMI (electromagnetic interference) problems inevitably occur. [0004] At present, in the design of printed circuit boards, the power supply layer and the ground layer form a planar resonant cavity, and there are some resonant frequency points in certain areas in the planar resonant cavity. [0005] If there is exactly the same frequency excitation source or signal line in the area where the resonance frequency appears in the printed circuit board design, it will cause the plane to resonate at this frequency. This creates el...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
Inventor 宋明哲范晓丽
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap