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SMT chip-mounting technology

A patch and process technology, applied in printing, printing devices, etc., can solve the problems of low output rate of semi-finished products, slow dispensing speed, instability, etc., to prevent wire drawing or penetration, ensure stability, and ensure stability. Effect

Inactive Publication Date: 2014-09-10
HAIMEN ZHONGDE ELECTRONICS DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage is that the dispensing speed is too slow, the output rate of semi-finished products is too low, and it is unstable and prone to wire drawing

Method used

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Examples

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Embodiment Construction

[0015] In order to deepen the understanding of the present invention, the present invention will be further described below in conjunction with examples, which are only used to explain the present invention and do not constitute a limitation to the protection scope of the present invention.

[0016] The SMT patch technology of the present invention comprises the following process steps:

[0017] a. Put the expanded metal plate on the screen printing machine, and then print with a steel ruler to ensure that the thickness of the conductive silver paste printed on each sheet is the same, to ensure the stability of the pressure of the squeegee during printing. The conductive silver paste is composed of silver paste and The glue is made in proportion, the mass ratio of silver paste to glue is 4:1, the thickness of conductive silver paste is 0.25-0.35mm,

[0018] b. Pour the silver glue ink on the expanded metal plate, install the steel ruler scraper on the machine table, adjust the...

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PUM

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Abstract

The invention discloses an SMT chip-mounting technology which comprises the following steps that a. a steel plate web plate is erected on a silk-screen machine table, then a steel ruler is used for printing, and the fact that the thicknesses of conducting silver paste printed from sheet materials are the same is guaranteed; b. silver colloid printing ink is poured onto the steel plate web plate, a steel ruler scraper is arranged on the machine table, a printing stroke is debugged, the sheet materials are placed on the machine table, a STAR key is pressed, after the steel ruler scraper and the steel plate web plate coincide, the scraper walks from left to right, silver colloids on the steel plate web plate are permeated onto the sheet materials through pressure, and silver colloid points are formed; and c. after silver colloid printing, the materials are put into an SMT automatic ship mounter, an SMT chip-mounting feeder is arranged, then a mounting program is debugged on computer software, after machine debugging, a lamp can be arranged, after lamp mounting, roasting is carried out in an drying oven, the materials are taken out, manual dispensing is carried out, and after dispensing, a next procedure is carried out for assembling. The technology has the advantages that the stability of scraper pressure during printing is guaranteed, and the speed and the quality pass percent are greatly improved compared with the prior art.

Description

technical field [0001] The invention relates to an SMT patch technology. Background technique [0002] There are two processes for printing circuit silver paste in the industry, screen printing silver paste and dispensing machine silver paste. The advantages and disadvantages of the two are described as follows: [0003] Screen printing: The advantage is that the printing speed is fast and the output rate of semi-finished products is high. The disadvantage is that the amount of silver paste is small, and the thickness of the silver paste attached to the surface of the material is only 15 μm. [0004] Dispensing silver paste by dispensing machine: the advantage is that the amount is large, and the thickness of the silver paste can reach 0.3mm. The disadvantage is that the dispensing speed is too slow, the output rate of semi-finished products is too low, and it is unstable and prone to stringing. [0005] Therefore, in order to solve the above problems, a new technical sol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41M1/12
Inventor 施一舟
Owner HAIMEN ZHONGDE ELECTRONICS DEV CO LTD
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