Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

COB (Chip On Board) ceramic substrate preparation method and COB light source

A ceramic substrate and alumina ceramic technology, which is applied in the field of COB ceramic substrate preparation and COB light source, can solve the problems of low cutting efficiency, achieve low cost, avoid internal structure damage, and improve production efficiency

Active Publication Date: 2014-09-10
GUANGZHOU LEDTEEN OPTOELECTRONICS CO LTD
View PDF4 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to propose a COB ceramic substrate preparation method, which can solve the problem of low cutting efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • COB (Chip On Board) ceramic substrate preparation method and COB light source
  • COB (Chip On Board) ceramic substrate preparation method and COB light source
  • COB (Chip On Board) ceramic substrate preparation method and COB light source

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Such as figure 1 Shown, a kind of COB ceramic substrate preparation method, it comprises the following steps:

[0033] Step S101 , injecting the alumina mixed slurry into the casting machine, selecting an appropriate blade height and casting speed according to the required thickness of the substrate to obtain a cast green sheet, and then drying and stripping the cast green sheet.

[0034] Wherein, the preparation process of the alumina mixed slurry is:

[0035] Mix alumina powder with a purity greater than 98.6%, deionized water and dispersant in a ratio of 1:1:0.012 and ball mill for 36 hours to obtain a slurry. The slurry after mixing in this ratio has a moderate viscosity and is suitable for casting machines Casting; the dispersion agent of the present embodiment preferably adopts polyacrylic acid;

[0036] In order to ensure the best dispersion effect of polyacrylic acid and achieve the best stability of the slurry, it is necessary to add ammonia water to adjust t...

Embodiment 2

[0048] The difference between the present embodiment and the first embodiment lies in the step of punching the cast blank by using the punching die. Specific as Figure 4 shown.

[0049] A method for preparing a COB ceramic substrate, comprising the following steps:

[0050] Step S201, injecting the alumina mixed slurry into a casting machine to obtain a casting green sheet.

[0051] Step S202 , punching the casting green sheet by using a punching die to obtain continuous sheets. The connected sheet refers to a plurality of green sheets connected together.

[0052] combine Figure 5 and Figure 6 As shown, the V-cut pre-cutting process can be performed between the sheets in the continuous sheet, and the V-cut depth of the V-cut pre-cutting process is 70% of the thickness of the cast green sheet 100 . That is, a V-shaped crack is cut on the cast green sheet 100 to form a cutting line 10 with a cutting depth of 70% of its thickness. A plurality of separate COB ceramic sub...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
reflectanceaaaaaaaaaa
Login to View More

Abstract

The invention relates to a COB (Chip On Board) ceramic substrate preparation method and a COB light source. The method comprises the steps: injecting alumina mixed slurry into a casting machine, so as to obtain a cast blank sheet; blanking the cast blank sheet by adopting a blanking die, so as to obtain single or contiguous sheets; carrying out gluing and sintering treatment on the single or contiguous sheets, so as to obtain alumina ceramic original boards; and printing circuit patterns on the alumina ceramic original boards, thereby obtaining COB ceramic substrates. Single or contiguous COB ceramic substrates can be directly obtained through blanking by the die, a laser cutting machine is not required to be adopted to cut and perforate the ceramic substrates, the internal structural damage to the ceramic substrates caused by laser energy is avoided, and residual leftover materials generated by casting and blanking can be recycled, so that the further increase of production efficiency and the further reduction of cost are facilitated.

Description

technical field [0001] The invention relates to a preparation method and structure of a COB substrate. Background technique [0002] Ceramic COB light sources use ceramic substrates for heat dissipation to ensure the luminous effect and service life of LED chips. However, traditional ceramic substrates need to be cut by laser. Laser cutting has low efficiency, difficult drilling, and easy damage to the substrate, which is not conducive to mass production . Contents of the invention [0003] The purpose of the present invention is to provide a method for preparing a COB ceramic substrate, which can solve the problem of low cutting efficiency. [0004] In order to achieve the above object, the technical scheme adopted in the present invention is as follows: [0005] A method for preparing a COB ceramic substrate, comprising the following steps: [0006] Step 1, injecting the alumina mixed slurry into a tape casting machine to obtain a tape casting green sheet; [000...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/10C04B35/622C04B41/81
Inventor 黄玉娇苏佳槟高艳春夏雪松
Owner GUANGZHOU LEDTEEN OPTOELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com