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Method and apparatus for encapsulating phosphor-coated LEDs

A fluorescent film and fluorescent layer technology, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve the problem of carrier substrate waste and other issues

Active Publication Date: 2017-12-05
EPISTAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can lead to wastage of the carrier substrate since the cut carrier substrate can no longer be used in manufacturing
[0006] Thus, while existing methods of packaging LEDs are often adequate for their intended purpose, they are not perfect in every respect.

Method used

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  • Method and apparatus for encapsulating phosphor-coated LEDs
  • Method and apparatus for encapsulating phosphor-coated LEDs
  • Method and apparatus for encapsulating phosphor-coated LEDs

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Embodiment Construction

[0045] It should be understood that the following disclosure provides many different embodiments, or examples, for implementing different components of the various embodiments. Specific examples of components and arrangements are described below to simplify the present disclosure. These are of course merely examples and are not intended to be limiting. For example, the following description in which a first component is formed over or on a second component may include embodiments in which the first and second components are formed in direct contact, and may also include embodiments in which additional components are formed on the first component. and the second part, such that the first and second parts are not in direct contact. Again, the terms "top," "bottom," "below," "above," etc. are for convenience and are not intended to limit the scope of the embodiments to any particular orientation. Various components may also be arbitrarily drawn in different sizes for clarity. ...

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Abstract

The present invention relates to a method for packaging a light emitting diode (LED). According to the method, a plurality of LEDs are disposed on an adhesive tape. The adhesive tape is disposed on a substrate. In one embodiment, the substrate might be a glass substrate, a silicon substrate, a ceramics substrate, or a gallium nitride substrate. The plurality of LEDs are coated by a fluorescent layer. Then the fluorescent layer is solidified. The adhesive tape and the substrate are removed after the solidification of the adhesive tape and the substrate. A replacement adhesive tape is attached to the plurality of LEDs. Cutting for the plurality of LEDS is carried out after the substrate being removed. The removed substrate can be used for successive LED packaging. The present invention also provides a method and a device for packaging LED coated with phosphor.

Description

[0001] priority date [0002] This application is a continuation-in-part (CIP) of U.S. Application Serial No. 13 / 594,219, entitled "Method and Apparatus for Fabricating Phosphor-Coated LED Dies," filed August 24, 2012 (Attorney Docket 2012-0082 / 48047.113), the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates generally to light emitting devices and, more particularly, to the packaging of phosphor covered light emitting diodes (LEDs). Background technique [0004] LEDs are semiconductor photonic devices that emit light when a voltage is applied. LEDs are becoming more and more popular due to favorable features such as small device size, long lifetime, efficient energy consumption, and good durability and reliability. In recent years, LEDs have been used in a variety of applications, including inductors, photosensitive sensors, traffic lights, broadband data transmission, backlight units for LCD displays, a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/50
CPCH01L25/0753H01L33/46H01L33/50H01L33/505H01L2224/13H01L2933/0041
Inventor 曾志翔李孝文吴民圣林天敏
Owner EPISTAR CORP