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Alignment system for various materials and material flows

An alignment system and imaging system technology, applied in the field of alignment systems, can solve problems such as field failures, pattern misalignment, and low reliability

Active Publication Date: 2014-09-10
CHIME BALL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Insufficient substrate and pattern alignment can result in misalignment of the pattern on the substrate, often resulting in rework, scrapped parts, or field failures due to low reliability

Method used

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  • Alignment system for various materials and material flows
  • Alignment system for various materials and material flows
  • Alignment system for various materials and material flows

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Embodiment Construction

[0051] refer to figure 1 , the alignment system 100 according to the present invention is shown applied to an embodiment with a continuous flow of material. Alignment system 100 is suitable for continuous or discontinuous material flow. Various embodiments of the alignment system 100 maintain objects that move continuously from a first or reference position to a second position and pass through the second position without stopping, objects that move from the first position and stop at the second position, remain in the The alignment of an item at a first location or an item that has been removed from a first location and returned to it for storage or further processing elsewhere. Embodiments of the alignment system 100 are applicable to lithography and photolithography, as in printing, semiconductor processing and circuit board processing, and computer-aided manufacturing or other processes requiring precision in object alignment.

[0052] In various embodiments of the align...

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PUM

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Abstract

A method and system for alignment of a tool to a workpiece in a continuous or discontinuous material flow are disclosed. The workpiece may be a portion of a web of material. An imaging system captures first and second images of the workpiece at first and second occasions respectively. Microscopic native features of the workpiece are selected, detected, tracked and / or compared in the first and second images. Based on the correspondence between, tracking or relative displacement of features as captured in the first and second images, an alignment to the workpiece is controlled. In embodiments, the workpiece and a tool, a projected image or a pattern to be imparted to the workpiece by a lithography or photolithography apparatus are aligned based upon positioning information determined from an analysis of correlated features or texture in the images. Positioning information may include a positioning error or a distortion indication.

Description

technical field [0001] The field of the invention relates generally to alignment systems, and more particularly to alignment of lithographic and other tool-based systems. Background technique [0002] In various systems and processes, the alignment of the tool and the workpiece allows the tool to be used to process the workpiece. Precise alignment of workpieces and tools typically utilizes alignment systems. Alignment can involve moving the workpiece, the tool, or both. [0003] Examples of systems and processes to which alignment systems can be applied include lithography, photolithography, laser etching, PCB masking, PCB drilling, flex circuit manufacturing, micromachining, precision assembly, robotics, computer-aided Manufacturing and other printing and manufacturing tasks. [0004] A lithographic system requires precise alignment of a workpiece, such as a printed circuit board or a semiconductor wafer, with lithographic equipment, such as projection optics. Since pri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03B27/58
CPCG03F9/00G03F7/70791G03F9/7088H05K3/0082H05K3/0008G03F9/7003
Inventor H·多泽
Owner CHIME BALL TECH
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