Method of hybrid cutting ceramic substrate led based on combined cutter

Abstract

The invention discloses a method for mixed cutting of a ceramic substrate LED based on a combined cutter. The combined cutter comprises a main shaft, a main shaft flange, two or more cutter bodies, a flange gasket, a gasket and a locking device, wherein the cutter bodies are metal-based diamond grinding wheels, and all the cutter bodies are identical in diameter. According to the cutting method, the same cutter is used for cutting a rubber layer and a ceramic substrate simultaneously, and transverse cutting in a cutter jumping mode and longitudinal cutting in a step-by-step cutter jumping mode are achieved. By means of the method, work efficiency can be improved, and cutting quality can be improved.

Description

technical field [0001] The invention relates to a hybrid cutting method for a ceramic substrate LED by a combined cutter. Background technique [0002] At present, the calorific value of a single high-power LED device increases significantly with the power. In order to solve the problem of heat dissipation, one of the solutions is to use metal or ceramic substrates. Among them, COB LEDs can use metal substrates or ceramic substrates, while CHIP LEDs Mainly use ceramic substrate. When CHIP LED is produced, it usually produces a large sheet of glue that has been dispensed, and then cuts the sheet, but ceramics are brittle and hard materials, so they can only be cut with a harder diamond wheel, and the cutting method is grinding. [0003] Diamond grinding wheels can be divided into metal-based diamond grinding wheels and resin-based diamond grinding wheels according to different binders. The nature of the substrate material determines the hardness of the diamond grinding wheel...

AI Technical Summary

Problems solved by technology

In general, the resin-based diamond grinding wheel has low hardness and good self-sharpening. It is suitable for grinding harder and more brittle materials, and the obtained surface accuracy is higher, but it wears faster; the metal-based diamond grinding wheel is the opposite

However, when glue has been dispensed on the surface of the CHIP LED chip, if the resin-based diamond grinding wheel is used, there will be a situation where the silicone sticks to the knife, so that part of the diamond blade cannot participate in the cutting, which affects the cutting effect of the ceramic. The common cutting problems are The cutting surface is inclined into a trapezoidal surface; at the same time, the cutting force of the grinding process is relatively large, which is easy to pull the gold wire on the chip, and the large cutting force brings large cutting heat, which is easy to burn out the silicone

The use of metal-based diamond grinding wheels can cut silicone smoothly, which can reduce or avoid the situation of silicone sticking to a certain extent, but the hardness of the grinding wheel is high, which intensifies the cracking of the ceramic substrate, forming a large number of cracks, chipping and protrusions, etc.

However, in order to take advantage of the above two grinding wheels, it is necessary to change the tool frequently. In this way, not only the efficiency is low, but also the error is enlarged due to the secondary positioning, resulting in low quality of final cutting

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