Low-temperature sinterable microwave dielectric ceramic limgv3o9 and its preparation method

Abstract

The invention discloses microwave dielectric ceramic LiMgV3O9 allowing low-temperature sintering and a preparation method of the microwave dielectric ceramic LiMgV3O9. The preparation method includes the steps that (1), Li2CO3 original powder, MgO original powder and V2O5 original powder are weighed and proportioned according to components of LiMgV3O9, wherein the purity of the original powder is over 99.9%; (2), wet-type ball milling is performed on the raw material in the step1 for 12 hours with distilled water being ball milling media and pre-sintered for 6 hours in the atmosphere at 650 DEG C after drying; (3), binding agents are added into powder obtained in the step2, granulation is performed, then, compression forming is performed, and finally sintering is performed for 4 hours in the atmosphere at 700 DEG C-730 DEG C, wherein polyvinyl alcohol solutions with the 5% concentricity are adopted as the binding agents, and the additive amount of polyvinyl alcohol accounts for 3% of the total mass of the powder. According to the prepared ceramic, sintering is good at 700 DEG C-730 DEG C, the dielectric constant reaches 17.6-18.3, the quality factor (Qf) value is up to 71000 GHz-93000 GHz, the temperature coefficient of resonance frequency is small, and the microwave dielectric ceramic has great application value in the industry.

Description

technical field [0001] The invention relates to a dielectric ceramic material, in particular to a microwave component such as a dielectric substrate used at a microwave frequency, a dielectric ceramic material of a ceramic capacitor or a temperature compensation capacitor and a preparation method thereof. Background technique [0002] Microwave dielectric ceramics refer to ceramics that are used as dielectric materials in circuits in the microwave frequency band (mainly UHF and SHF bands) and perform one or more functions. They are widely used as resonators, filters, and dielectric substrates in modern communications. Components such as chips and dielectric waveguide circuits are the key basic materials of modern communication technology. They have been used in portable mobile phones, car phones, cordless phones, TV satellite receivers and military radars. They are used in modern communication tools. It is playing an increasingly important role in the process of miniaturizat...

AI Technical Summary

Problems solved by technology

[0010] In the process of exploring and developing new low-firing microwave dielectric ceramic materials, material systems such as Li-based compounds, Bi-based compounds, tungstate compounds and tellurate-based compounds with inherently low sintering temperatures have received extensive attention and research. A large number of exploratory studies have focused on Li-based binary or ternary compounds, and developed such as Li 2 TiO 3 , Li 2 MoO 4 and Li 2 MTi 3 o 8 (M=Mg or Zn) series of microwave dielectric ceramics with good performance, etc., but the microwave dielectric ceramic system that can be fired at low temperature is still relatively limited, and the τ of single-phase microwave dielectric ceramics with low inherent sintering temperature ? Usually large, can not meet the requirements of device thermal stability, which largely limits the development of low temperature co-firing technology and microwave multilayer devices

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