Structure and manufacturing method of a metal-based printed board with high thermal conductivity
A technology of metal substrates and manufacturing methods, which is applied in the direction of printed circuit manufacturing, printed circuits connected with non-printed electrical components, circuit substrate materials, etc., can solve the problems of not being able to adapt to the development of new LED technologies and affecting heat dissipation efficiency, etc. , to achieve the effects of simple and easy processing, high-efficiency heat conduction, and high safety
Active Publication Date: 2017-02-15
GUANGDONG CHENGDE ELECTRONICS TECH CO LTD
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Problems solved by technology
This method still uses a heat-conducting medium, which still affects the improvement of heat dissipation efficiency
[0004] In addition, with the chip-based development of LED lamp beads, the traditional heat dissipation structures mentioned above can no longer adapt to the development of new LED technologies.
Method used
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Embodiment Construction
[0038] In order to fully understand the technical content of the present invention, the technical solutions of the present invention will be further introduced and illustrated below in conjunction with specific examples, but not limited thereto.
[0039] Such as Figure 1 to Figure 2 In the specific embodiment shown, the structure of a metal-based printed board with high thermal conductivity in the present invention includes a metal substrate 10, and the metal substrate 10 includes several heat-conducting discs 20 for contacting the bottom of the LED lamp bead; other areas cover There is an insulating layer 30 and a conductive layer 40; the height of the heat conducting plate 20 is equal to the sum of the thicknesses of the insulating layer 30 and the conducting layer 40; the conducting layer 40 is provided with a printed circuit (for forming a power supply circuit of the LED); the heat conducting plate 20 and the The surfaces of the conductive layer 40 are on the same plane, ...
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The invention discloses a high thermal conductivity metal matrix printed board structure and manufacturing method. The high thermal conductivity metal matrix printed board structure comprises a metal substrate, the metal substrate comprises a plurality of thermal conducting discs used for making contact with the bottoms of LED lamp beads, other areas without the thermal conducting discs are covered with an insulation layer and a conducting layer, and the height of each thermal conducting disc is the sum of the thickness of the insulation layer and the thickness of the conducting layer; the conducting layer is provided with a printed circuit; the surface of each thermal conducting disc and the surface of the conducting layer are located on the same plane. The high thermal conductivity metal matrix printed board structure has the efficient thermal conducting effect and can be used for various paster type LEDs. In the thermal compression process, two layers of release paper and a silica gel layer between the two layers of release paper are additionally arranged, silica gel materials of corresponding hardness can be selected to control gel flow of PP prepreg in the thermal compression process, and metal substrates coincident in quality can be processed out.
Description
technical field [0001] The invention relates to a structure of a metal-based printed board which is easy to conduct heat, and more specifically refers to a structure and a manufacturing method of a metal-based printed board with high thermal conductivity. Background technique [0002] In the prior art, in order to solve the heat dissipation problem of LED lamps, people have used many methods, and most of them are found in patent documents of various countries. Among them, the Chinese patent document CN103702515A discloses a high-power LED lamp bead metal substrate structure for the installation of LED lamp beads. The metal substrate includes a copper foil wiring layer, an insulating layer, and a metal substrate layer arranged in sequence from top to bottom. , the conductive electrode pins of the LED lamp bead are connected to the copper foil wiring layer; the bottom surface of the metal substrate layer is provided with a recess corresponding to the heat-conducting metal pad ...
Claims
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IPC IPC(8): H05K1/18H05K1/02H05K1/05H05K3/00
Inventor 刘镇权吴子坚
Owner GUANGDONG CHENGDE ELECTRONICS TECH CO LTD