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Combined type device for plating MOF film through electrodeposition method

An electrodeposition method and a combined technology, applied in the direction of the electrode, can solve the problems of uneven stress surface and difficulty in obtaining a dense and uniform film, so as to eliminate concentration polarization, delay passivation, and facilitate extraction. Effect

Inactive Publication Date: 2014-10-01
TIANJIN POLYTECHNIC UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The geometric shape of the tube makes the force on its surface uneven, and it is difficult to obtain a dense and uniform film

Method used

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  • Combined type device for plating MOF film through electrodeposition method
  • Combined type device for plating MOF film through electrodeposition method
  • Combined type device for plating MOF film through electrodeposition method

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Embodiment Construction

[0020] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

[0021] like figure 1 , 2 Shown, the present invention is used for the combined device of electrodeposition plating MOF membrane, comprises base 2, anode, cathode and the external power supply (not shown) that is connected with cathode, anode and is used for electroplating, and anode is compression spring The anode 1 and the cathode are tubular cathodes 6. A circular hole 4 for inserting the tubular cathode 6 is provided in the middle of the base 2. An annular groove 5 is provided on the base 2 with the circular hole 4 as the center of the circle. The compression spring anode 1 is embedded in the In the annular groove 5, the compression spring anode 1 and the tubular cathode 6 are equally spaced and combined.

[0022] The spring anode 1 is a material that needs to be formed into a film, and the tube-mounted cathode 6 is a carrier that needs to ...

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Abstract

The invention discloses a combined type device for plating an MOF film through an electrodeposition method. The combined type device comprises a base, an anode, a cathode and an external power source connected with the anode and the cathode and used for electroplating, wherein the anode is a pressure spring anode; the cathode is a tubular cathode; a round hole for inserting the tubular cathode in an embedding manner is formed in the middle of the base; a ring-shaped groove taking the round hole as the center is formed in the base; the pressure spring anode is inserted in the ring-shaped groove in an embedding manner, so that the pressure spring anode and the tubular cathode are combined in a sleeving manner at equal distance; the pressure spring anode is processed of a high-purity copper wire; the tubular cathode is made of a carbon tube or other conducting materials; the pressure spring anode is inserted in the groove of the base of round supporting pillars in an embedding manner; the tubular cathode is inserted in the middle round hole in an embedding manner. The combined type device has the characteristics of being simple to manufacture, convenient to combine, low in cost and the like, and has significant application value on MOF film generation on the surface of a tubular material though the electrodeposition method.

Description

technical field [0001] The invention relates to an electrodeposition device, in particular to a combined device for plating MOF films by electrodeposition. Background technique [0002] Metal-organic framework (MOF), usually refers to the crystalline material with periodic infinite network structure formed by metal ions or metal clusters and organic ligands through self-assembly process, which has good mechanical properties, good stability, high Porosity, large surface area, high permeability and other excellent characteristics. Nowadays, most of MOF membranes stay in the research of flat membranes or sheet membranes, and the methods basically stay in the hydrothermal method and various improvement methods. [0003] The growth of MOF on copper grids by electrodeposition has been reported in the literature. Compared with sheet-shaped carriers, the tube-shaped carrier has a large surface area and is easy to assemble into components, which has higher application value. The ge...

Claims

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Application Information

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IPC IPC(8): C25D17/12
Inventor 赵永男孟令波余建国
Owner TIANJIN POLYTECHNIC UNIV
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