Heat-tube composite liquid absorption core and preparation method for same

Abstract

The invention discloses a heat-tube composite liquid absorption core and a preparation method for the same. The heat-tube composite liquid absorption core is of a tubular structure, and comprises a metal outer sleeve and a metal porous flow channel, wherein the outer wall of the metal porous flow channel is in close fit with the inner wall of the metal outer sleeve; the metal porous flow channel is formed by carrying out solid-phase sintering on metal powder particles with particle sizes of 40-180 microns, the surface and the interior of the metal porous flow channel are provided with porous pore structures with an average pore diameter of 10-100 microns, and the inner wall surface of the metal porous flow channel is uniformly distributed with 20-60 liquid absorption grooves with lengths which are the same as the axial length of the metal porous flow channel along the peripheral direction thereof; each of the liquid absorption grooves comprises an embedded groove body and a slit, and the embedded groove body is communicated with the cavity of the metal porous flow channel through the slit. The heat-tube composite liquid absorption core disclosed by the invention is simple in manufacturing process and low in production cost, and capable of effectively making up the defects of a single groove or a sintering liquid absorption core, increasing a capillary pressure, reducing a liquid backflow resistance and increasing a permeability; meanwhile, the liquid absorption grooves are capable of effectively weakening the reverse shearing of steam flowing for liquid flowing, thus greatly improving the heat transfer performance of a heat tube.

Description

technical field [0001] The invention belongs to the technical field of heat pipes, and in particular relates to a heat pipe composite liquid-absorbing core and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of microelectronic product technology, the power of electronic equipment has increased sharply, while the physical size has become smaller and smaller, and the problem of product failure caused by high heat flux has become increasingly serious. Heat pipes with high thermal conductivity, high reliability, fast thermal response, and no need for additional electric drives are ideal for solving high heat flux density chip cooling problems. The heat transfer performance of the heat pipe is mainly determined by the structure of the capillary wick. At present, the commonly used structure of the wick of the heat pipe is usually composed of a single form of wire mesh, sintered powder, and grooves. Among them, the screen-typ...

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Problems solved by technology

However, due to the smooth wall structure of the inner groove, its effect of increasing capillary pressure is limited; and the h

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