Method for improving cutter breaking condition in hole drilling process of thick copper plate
A technology of thick copper plate and knife breaking, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve the problems such as easy to break the knife, achieve the effect of reducing the overall hardness, reducing the phenomenon of knife breaking, and shortening the production cycle
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[0017] The present invention provides a method for improving drill breakage of thick copper plates. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0018] see figure 1 , figure 1 It is a flow chart of a preferred embodiment of a method for improving the method of drilling and breaking a thick copper plate of the present invention, as shown in the figure, which includes steps:
[0019] S101, blank the line film design for the position where drilling is required, and open a window for the solder resist film design at the position where drilling is required;
[0020] S102. During alignment, align with the MARK point of the line;
[0021] S103 , after developing, etching, and film-removing treatments, etc...
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