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Method for improving cutter breaking condition in hole drilling process of thick copper plate

A technology of thick copper plate and knife breaking, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve the problems such as easy to break the knife, achieve the effect of reducing the overall hardness, reducing the phenomenon of knife breaking, and shortening the production cycle

Inactive Publication Date: 2014-10-08
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a method for improving the cutting tool breaking in thick copper plate drilling, aiming to solve the problem that the existing thick copper plate is prone to knife breaking when drilling

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  • Method for improving cutter breaking condition in hole drilling process of thick copper plate

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Embodiment Construction

[0017] The present invention provides a method for improving drill breakage of thick copper plates. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0018] see figure 1 , figure 1 It is a flow chart of a preferred embodiment of a method for improving the method of drilling and breaking a thick copper plate of the present invention, as shown in the figure, which includes steps:

[0019] S101, blank the line film design for the position where drilling is required, and open a window for the solder resist film design at the position where drilling is required;

[0020] S102. During alignment, align with the MARK point of the line;

[0021] S103 , after developing, etching, and film-removing treatments, etc...

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Abstract

The invention discloses a method for improving cutter breaking condition in the hole drilling process of a thick copper plate. The method comprises the steps that A, a circuit film of the position where holes need to be drilled is designed to be blank, and meanwhile a solder resist film of the position where holes need to be drilled is designed to be windowed; B, during counterpoint, MARK points of lines are used for conducting counterpoint; C, through treatment of developing, etching and film removing, copper sheets at pore ring positions are etched. According to the method for improving the cutter breaking condition in the hole drilling process of the thick copper plate, the film for manufacturing a circuit is redesigned, the position where the holes need to be drilled is designed to be blank, meanwhile, the solder resist film of the position where the holes needs to be drilled is designed to be windowed, after counterpoint and exposure, the copper sheets at the pore ring positions are etched, the overall hardness of plates is lowered, so that subsequent hole drilling is conducted conveniently, and the phenomenon of cuter breaking is reduced. According to the method, only the circuit film and the solder resist film need to be designed, the production cycle is greatly shortened, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for improving drilling and breaking of thick copper plates. Background technique [0002] With the rapid development of the line industry, multi-layer boards and thick copper-aluminum clad boards are used more and more widely. To complete the production of such products, the performance requirements of the machines are also getting higher and higher. Conventional drilling rigs are not suitable for such products. When the plate is drilled, the phenomenon of knife breaking is relatively frequent, which is not suitable for mass production, reduces production efficiency, and also affects product quality. [0003] Therefore, the prior art still needs to be improved and developed. Contents of the invention [0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a method for improving the cutting...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 邓昱
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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