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Black hole horizontal production line technological process and black hole groove structure

A technology of process flow and production line, applied in the direction of electrical connection formation of printing components, etc., can solve the problems of weak liquid penetration, disconnection, etc., and achieve the effect of improved yield rate and good connection in holes

Inactive Publication Date: 2014-10-15
SHENZHEN HUALIN CIRCUIT TECH
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a black hole horizontal production line process flow and black hole groove structure to solve the problem of disconnection in the hole after copper plating caused by the weak liquid penetration of the existing black hole horizontal production line

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  • Black hole horizontal production line technological process and black hole groove structure
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  • Black hole horizontal production line technological process and black hole groove structure

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Embodiment Construction

[0024] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0025] In the present invention, an ultrasonic vibrating plate is added at the entrance of the black hole groove 1 and / or the black hole groove 2, and the ultrasonic cavitation effect is accompanied by mechanical effects such as micro-jet flow, shock wave and acoustic rush flow generated by ultrasonic cavitation to cause liquid flow. Macroscopic turbulence is conducive to material transfer and penetration into different media surfaces and gaps, fully allowing the bubbles in the pores to precipitate, so that the liquid can flow through the hole and react with the hole wall, and solve the problem of b...

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Abstract

The invention provides a black hole horizontal production line technological process and a black hole groove structure. The technological process comprises the steps of cleaning, black hole 1, hole cleaning, black hole 2, micro-etching, anti-oxidation processing and discharging, wherein the black hole 1 further comprises ultrasonic immersion cleaning. According to the black hole horizontal production line technological process provided by the invention, ultrasonic immersion cleaning steps are added in black hole 1 and / or black hole 2 feeding, since micro jet flows and strong impact waves which are generated by an ultrasonic cavitation effect have strong seepage forces for Phi 0.15mm and Phi 0.2mm micro holes, and therefore, air bubbles in the holes can be sufficiently precipitated out, and solutions can flow through the holes and react with the walls of the holes, and thus, the problem of black hole fracture of a multi-layer board because of air bubbles can be solved, and intra-hole connection is excellent after copper plating is performed, and qualified rate can be greatly improved.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a black hole horizontal production line process and a black hole groove structure. Background technique [0002] The black hole (BlackHole) horizontal production line belongs to a kind of direct electroplating, that is, the hole wall is conductiveized by non-traditional chemical copper on the hole wall after drilling. A conductive carbon film of fine graphite carbon black is adsorbed on the wall to provide a base for subsequent electroplating seeds. [0003] Existing, BlackHole horizontal production line process flow: As shown in Table 1: [0004] Table 1 [0005] [0006] [0007] At present, the BlackHole horizontal production line adopts the upper and lower water jet immersion treatment method. There are 4 pairs of water jets in the whole hole slot, 4 pairs of water jets in the first slot of the black hole, and 7 pairs of water jets in the second slot of the b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42C25D5/34
Inventor 宁金足汪传林郭瑞明秦涛潘陈华
Owner SHENZHEN HUALIN CIRCUIT TECH
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