Chip scale LED (light emitting diode) package structure

Abstract

The invention discloses a chip scale LED package structure. The chip scale LED package structure comprises an LED chip with electrodes on the bottom surface, and a package adhesive body which packs the top surface and the side surfaces of the LED chip. At least one of the bottom and the side surface of the package adhesive body is provided with a reflect surface which is a reflective curved surface or a reflective flat surface extending from the bottom of the package adhesive body to the side surface of the package adhesive body. By arranging the reflective surfaces with high reflectivity on the bottom surface and / or the side surface of the package adhesive body, the chip scale LED package structure can effectively the deficiency that light is emitted out from the bottom or the side surface of the package adhesive body to result in ineffective light extraction, thereby improving the light extraction efficiency of products and reducing light losses; besides, by means of the reflective surfaces on the side surface and the bottom surface of the package adhesive body, the chip scale LED package structure can well control the light emitting angles of the products, facilitating formation of a single light exiting surface and further facilitating using compatibility of the products on different occasions. The chip scale LED package structure can be widely applied to manufacturing chip scale package LED products in the fields such as backlight and lighting.

Description

technical field [0001] The invention relates to an LED package technology, in particular to a chip-level package LED package structure. Background technique [0002] The traditional LED packaging structure needs to use a bracket or a substrate as a support carrier for the LED chip. The bracket or the substrate is provided with positive and negative electrodes, and the electrical connection of the packaged product is completed by bonding the positive and negative electrodes of the chip; The phosphor colloid encapsulates the chip to obtain an LED package. The bracket or the substrate is generally provided with a reflective cavity with a certain reflective surface or a reflective layer of the substrate, which can effectively improve the extraction rate of light emitted by the chip. [0003] and figure 1 The structure shown is a new type of chip-scale package LED (CSP LED; Chip Scale Package LED) based on flip-chip. In this package structure, the bottom surface of the chip 1 is...

AI Technical Summary

Problems solved by technology

[0003] and figure 1 The structure shown is a new type of chip-scale package LED (CSP LED; Chip Scale Package LED) based on flip-chip. In this package structure, the bottom surface of the chip 1 is provided with electrodes 2, which are directly packaged on the upper surface and side of the chip 1. The colloid 3 exposes the electrode 2 on the bottom surface. Since this packaging structure has no support or substrate, the thermal resistance and cost of the packaged product can be reduced. layer, making the light extraction rate of this packaging structure lower than that of traditional LED packaging structures, this defect also seriously affects the cost performance and application promotion of CSP LEDs

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