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Segmented electroluminescent device with distributed load elements

一种负载元件、致发光的技术，应用在电致发光光源、非印制电元件相联接的印刷电路、电光源等方向，能够解决不能被集成薄膜结构等问题

Active Publication Date: 2014-11-12
OLEDWORKS GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Sometimes it may be desirable to use only standard components (i.e. OLEDs and resistors) or ballast circuits which cannot be integrated into simple thin film structures

Method used

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  • Segmented electroluminescent device with distributed load elements
  • Segmented electroluminescent device with distributed load elements
  • Segmented electroluminescent device with distributed load elements

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] In the following examples, the invention will be described based on an OLED lighting device based on a load element or ballast assembly R 1 to R n An array of combined standard OLED segments or blocks D 1 to D n array, the load element or ballast assembly R 1 to R n The array is mounted on a carrier board (printed circuit board (PCB)) in such a way that the power losses are spread evenly across the entire board area so that the ballast assembly R 1 to R n The local electric power in is minimum. unavoidable residual hot spots (e.g. by ballast components R 1 to R n created) and the OLED block D 1 to D n The thermal coupling is via the interconnect structure in such a way that the additional heat load on the OLED emissive layer is as symmetrical as possible with respect to the self-heating of the OLED device. This is accomplished by combining properly designed thermal spreading of the interconnect structure with the OLED block D 1 to D n and ballast assembly R ...

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PUM

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Abstract

The invention relates to an electroluminescent lighting device, which is based on an array of standard electroluminescent tiles (D1 - Dn) combined with an array of ballast components (R1 - Rn) mounted on a carrier board (30) in such a way that the power loss is evenly spread across the whole board area to minimize local electric power in the ballast components. The unavoidable remaining hot spots and electroluminescent tiles are thermally coupled in such a way that the additional thermal load on the electroluminescent emission layer is as symmetric as possible with respect to the self heating of the electroluminescent device. This can be achieved by a combination of properly designed heat spreading and thermal isolation of the electroluminescent and ballast components. Heat spreading is achieved by a properly designed interconnection structure (40) on the carrier board. Different options are proposed to thermally isolate the electroluminescent tiles from the hot spots.

Description

technical field [0001] The present invention relates to the field of electroluminescent devices, and more particularly to organic light emitting diode (OLED) devices, and to the field of segmented lighting devices. Background technique [0002] An electroluminescent device includes an electroluminescent material that is capable of emitting light when an electric current is passed through it. Materials used in electroluminescent devices can be light emitting polymers or small organic molecules. An organic device may eg be an OLED. In order to activate the electroluminescent device, an electric current is applied to the electroluminescent material by means of the electrodes. [0003] More specifically, electroluminescent devices such as OLEDs include an electroluminescent material disposed between electrodes. When a suitable voltage is applied, current flows from the anode to the cathode through the electroluminescent material. Light is generated by the radiative combinati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H05K1/02H05B33/08H05K1/18H05B44/00
CPCH05K1/182H05K2201/062H05K1/0201H05K2201/10022H05K1/0209H05K2201/0116H01L2251/5361H05K2201/10106H05B33/0821H05B33/0896H01L27/3204H05B45/40H05B45/60Y02B20/30H10K59/86F21V29/89F21V29/502
Inventor D.亨特
Owner OLEDWORKS GMBH
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