A fast-response thermosensitive chip and its manufacturing method

Abstract

The invention belongs to the technical field of temperature-sensitive chip products, and concretely discloses a quick-response temperature-sensitive chip. The quick-response temperature-sensitive chip comprises a ceramic basic sheet, two surfaces of the ceramic basic sheet are both provided with a surface electrode through printing sintering infiltration, and one end of the ceramic basic sheet is terminated through a temperature-sensitive material layer. The manufacturing method of the quick-response temperature-sensitive chip comprises the concrete steps: (1) selecting the ceramic basic sheet; (2) performing printing and sintering infiltration to obtain the surface electrodes; (3) cutting up; (4) terminating a single end; (5) drying and sintering; and (6) testing. In a temperature measurement process, the NTC temperature-sensitive chip is short in thermal conduction time, small in thermal time constant and high in sensitivity, is capable of effectively satisfying the high-sensitivity requirement on temperature measurement, and is high in reliability and good in resistance value consistency, the chip product qualified rate high, and the manufacturing method is simple and easy to realize.

Description

technical field [0001] The invention belongs to the technical field of heat-sensitive chip products, and in particular relates to a fast-response heat-sensitive chip and a manufacturing method thereof. Background technique [0002] NTC thermal chips are widely used in various temperature detection, temperature compensation, and temperature control circuits because of their large cold-state resistance and gradually decreasing resistance as the temperature rises. It plays a central role in forming the desired electronic signal. [0003] With the development of electronic technology, various electronic products are further multi-functional and intelligent, and NTC thermal chips are increasingly used in various occasions that require temperature detection, control, and compensation. Due to the sensitivity requirements of temperature detection, higher and higher requirements are put forward for the response speed of the thermal chip, which requires the thermal time constant of t...

AI Technical Summary

Problems solved by technology

[0007] (1) Low sensitivity: such as figure 2 As shown, when the semiconductor ceramic body 1' of the NTC thermal chip is thicker and fully reaches the external temperature, it takes a long time, and the thermal time constant is generally 5.15 seconds. This reaction speed cannot meet the high sensitivity requirements for temperature detection;

[0008] (2) Low reliability: due to the strong brittleness of the semiconductor ceramic body 1' of the NTC thermal chip, when the surface electrode 2' of the chip is assembled into a resistance welding lead, it will be subjected to external force, and the ceramic body will be subjected to vibration and pressure. Easy to crack and break;

[0009] (3) Low precision: Since the ingot formed by NTC ceramic ingot has a certain thickness, its middle and sides are affected by factors such as material dispersion, density and uniformity of sintering atmosphere, and its resistance value R±1% The qualified rate is generally only about 50%, so the accuracy is low, and the temperature response cannot be better.

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