Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Array substrate, manufacturing method and liquid crystal display panel

An array substrate and manufacturing method technology, applied in the display field, can solve the problems of TFT device damage, slow charging, electrical drift, etc., and achieve the effects of reducing damage, reducing static electricity accumulation, and improving stability

Active Publication Date: 2017-09-01
XIAMEN TIANMA MICRO ELECTRONICS +1
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the manufacturing process of the array substrate, due to frictional electrification, contact separation electrification and induction electrification, etc., more charges are accumulated on the substrate. The lower conductive layer is exposed. During the process of photoresist stripping and cleaning, it is easy to cause electrostatic discharge, which will cause the TFT device to be hit or damaged by static electricity and cause electrical drift, which will cause the charging process of the pixel electrode to be slower or slower than normal. Fast, so that it is lower or higher than the normal pixel potential, resulting in bright and dark Mura (uneven) areas

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Array substrate, manufacturing method and liquid crystal display panel
  • Array substrate, manufacturing method and liquid crystal display panel
  • Array substrate, manufacturing method and liquid crystal display panel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0029] It should be noted that in the following description, specific details are set forth in order to fully understand the present invention. However, the present invention can be implemented in many other ways than those described here, and those skilled in the art can make similar extensions without departing from the connotation of the present invention. Accordingly, the present invention is not limited to the specific embodiments disclosed below.

[0030] figure 1 It is a schematic cross-sectional structure diagram of an array substrate provided by an embodiment of the present invention, Pa is the display area of ​​the array substrate, and Pb is the peripheral area of ​​the array substrate.

[0031] refer to figure 1 , the array substrate i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

An array substrate is disclosed. The array substrate includes a substrate, a first film layer on a side surface of the substrate, an insulation layer on the side surface of the substrate, an electrostatic charge dispersion layer on the side surface of the substrate, and a second film layer arranged on the side surface of the substrate. The first film layer, the insulation layer, the electrostatic charge dispersion layer, and the second film layer are sequentially arranged on the substrate. In addition, the insulation layer and the electrostatic charge dispersion layer include via holes, the second film layer is electrically connected with the first film layer through the via holes, and the electrostatic charge dispersion layer is in a same profile as the second film layer.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate and a manufacturing method thereof. Background technique [0002] With the development of display manufacturing technology, Thin Film Transistor-Liquid Crystal Display (TFT-LCD) occupies a dominant position in the flat panel display market due to its advantages of small size, low power consumption, and high resolution. . [0003] According to the working mode of its liquid crystal, TFT-LCD mainly includes the following two types: one is the vertical electric field method, in which the liquid crystal layer is driven by an electric field in a direction approximately perpendicular to the substrate surface, and the light incident on the liquid crystal layer is controlled. Modulation to achieve display, this kind of display mode mainly includes twisted nematic (Twisted Nematic, TN) mode, multi-domain vertical alignment (Multi-domain Vertical Alignment, MVA...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12H01L21/77G02F1/13
CPCG02F1/136204G02F1/136227H01L21/02532H01L21/02686H01L21/31144H01L21/32134H01L21/76804H01L21/76805H01L27/0288H01L27/1222H01L27/124H01L27/1274H01L29/66757H01L29/78675
Inventor 文亮
Owner XIAMEN TIANMA MICRO ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com