Cleaning device of chemical mechanical polishing pad and cleaning method thereof

Abstract

A cleaning device of a chemical mechanical polishing pad comprises a polishing liquid distribution arm fixed on a polishing bench over a pad polishing table. Nozzles communicated with deionized water are disposed on one side, close to the polishing pad, of the polishing liquid distribution arm at intervals. The nozzles are in sector arrangement; the nozzles are obliquely arranged, with an included angle alpha, not smaller than 30 degrees, with a plane of the polishing pad. The nozzles communicated with the deionized water are disposed on one side, close to the polishing pad, of the polishing liquid distribution arm at intervals, the nozzles are arranged in sector arrangement and are obliquely arranged, with the included angle alpha, not smaller than 30 degrees, with the plane of the polishing pad, and accordingly, contact area of the deionized water with the surface of the polishing pad is increased, force of water flow is enhanced, and high cleaning efficiency is achieved.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing of semiconductors, in particular to a cleaning device and method for a polishing pad of chemical mechanical polishing. Background technique [0002] With the rapid development of ultra-large-scale integrated circuits, the manufacturing process of integrated circuits has become more and more complex and sophisticated. In order to improve integration and reduce manufacturing costs, the size of semiconductor devices is decreasing day by day, and it is difficult for planar wiring to meet the requirements of high-density distribution. Therefore, only multilayer wiring technology can be used to further increase the integration density of semiconductor devices. Due to the deposition process of multi-layer interconnection or relatively large filling depth, the wafer surface is excessively undulating, which causes difficulties in focusing the photolithography process, weakens the abil...

AI Technical Summary

Problems solved by technology

[0007] The present invention is aimed at the prior art. The nozzles of the traditional abrasive liquid distributing arm are all arranged above the abrasive liquid distributing arm, and the nozzles are designed obliquely downward, which not only causes the sprayed deionized water to collide with the polishing pad The contact area is too small, and the force of the water spray in the horizontal direction is small, resulting in unsatisfactory cleaning ability and affecting the yield of end products. Provide a cleaning device for chemical mechanical polishing pads

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