Rapid forced cooling furnace device for electronic powder materials

Abstract

The invention relates to a fast forced cooling furnace device for electronic powder material and belongs to the technical field of cooling devices. The fast forced cooling furnace device comprises a frame, a lower furnace shell, an upper furnace shell, a cooling furnace tube, a power transmission mechanism and a cooling medium spraying mechanism. The lower furnace shell is supported above the frame. A cooling medium guide-out connecting pipe is arranged at the bottom of the lower furnace shell. The upper furnace shell above the lower furnace shell is fixed with the lower furnace shell. The middle portion of the cooling furnace tube is located between the upper furnace shell and the lower furnace shell and surrounded by the two. Two ends of the cooling furnace tube extend out of the upper furnace shell and the lower furnace shell and are supported on the frame. Openings at two ends of a cooling furnace tube cavity are unsealed. The power transmission mechanism is disposed on the frame and connected with the cooling furnace tube. The cooling medium spraying mechanism is disposed in the upper furnace shell and corresponds to the middle portion of the cooling furnace tube. The fast forced cooling furnace device has the advantages that the electronic powder material can be cooled fast when passing the cooling furnace tube cavity, and the efficient production requirements of an electronic kiln is satisfied; quality of the electronic powder material is guaranteed; even cooling is achieved, and agglomeration of the electronic powder material is avoided.

Description

technical field [0001] The invention belongs to the technical field of cooling devices, and in particular relates to a fast forced cooling furnace device for electronic powder materials. Background technique [0002] Electronic powder materials mentioned above such as color phosphor, lamp powder, barium titanate, strontium titanate, yttrium trioxide, titanium dioxide, zirconium dioxide, bismuth oxide, alumina, lead zirconate titanate, ferrite magnetic powder and lithium iron phosphate, among others. These electronic powder materials are not limited to examples, usually need to be loaded into a sagger and sent to an electronic kiln for high-temperature firing, and then go out of the electronic kiln after firing, and the crushing device belonging to the structural system of the auxiliary facility of the electronic kiln The electronic powder material in the sagger is disintegrated, and then the electronic powder material in the sagger is discharged by the discharging device a...

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Problems solved by technology

[0003] Since the temperature of the electronic powder material crushed by the crushing device and poured out by the discharge device is much higher than the ambient temperature, it is difficult to immediately introduce the packaging process, so it is usually necessary to wait for it to cool naturally to close to room temperature before cooling to the aforementioned The packaging is carried out after the ambient temperature, so the following technical problems are caused: one is that the electronic kiln is continuously fed and discharged. The hearth of the furnace enters the furnace, and completes the firing in the state of slow progress and leads out from the furnace outlet of the electronic kiln, so the production efficiency is high. Therefore, due to the natural cooling process, there is material accumulation in the packaging station In addition, if the electronic powder material is not effectively cooled and packaged in a hurry, the temperature in the packaging container is very different from the outside world, which will affect the quality of the electronic powder material; the second is due to the electronic powder in the natural cooling process Bulk materials are usually exposed for a long time, so they are easily affected by the external environment such as humidity and dust. For example, humidity will cause oxidation of electronic powder materials, and dust will affect the purity of electronic powder materials; The third is that the electronic powder material is prone to agglomeration (agglomeration) during the natural cooling process, which affects the quality of the electronic powder material

[0004] The applicant has searched the literature, but in the Chinese and foreign patents and non-patent literature disclosed so far, there is no enlightenment to solve the above technical problems

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