Self-inspection and burning device and method of stamp hole packaging core board

Abstract

The invention discloses a self-inspection and burning device and method of a stamp hole packaging core board. The device comprises a test board and a stamp hole bonding pad interface module, wherein the stamp hole bonding pad interface module is provided with a plurality of thimbles which correspondingly contact with stamp holes one by one; and the test board comprises a SPI (Serial Peripheral Interface) FLASH memory module and a stamp hole bonding pad interface hardware self-inspection module, wherein the stamp hole bonding pad interface module is electrically connected with the SPI FLASH memory module and is also electrically connected with the stamp hole bonding pad interface hardware self-inspection module. When the self-inspection and burning device of the stamp hole packaging core board is adopted, the core board can be immediately subjected to hardware detection after the core board welding is finished to detect whether core board hardware is normal or not. If welding rejects are found, the welding rejects are immediately subjected to reworking processing, all problems relating to the poor welding of a BGA (Ball Grid Array) packaging device can be solved in an outsourcing machining stage, the quality of the core board can be guaranteed, and production efficiency is greatly improved.

Description

technical field [0001] The invention relates to the technical field of core boards, in particular to a core board self-inspection and programming device and method packaged with stamp holes. Background technique [0002] The four sides of the core board packaged with stamp holes are all metalized half holes, and the core board packaged with stamp holes will be referred to as the core board for short. Among them, most of the core boards are multi-layer boards, including control modules, NAND FLASH storage modules and DDR2 SDRAM (DDR2 SDRAM: Double-Data-Rate Two Synchronous Dynamic Random Access Memory second generation double data rate synchronous dynamic random access memory ) memory module, and often has a BGA (BGA: Ball Grid Array ball grid array structure PCB, which is a packaging method in which integrated circuits use organic carrier boards) packaging devices, which have high requirements for processing, welding and other processes. The cost is also very high. [0003...

AI Technical Summary

Problems solved by technology

[0004] First of all, once there is a problem with the product, it is not only difficult to locate the fault point and the cause of the fault, but also to desolder the core board with many pad feet, which consumes a lot of time for the staff and reduces the production efficiency

Moreover, in the process of desoldering, the core board is easily damaged by human beings, which increases the production cost of the product

[0005] Secondly, after the core board is assembled, it needs to be connected to a computer to burn the program, which is extremely inconvenient to use. Large, long burning time, extremely low efficiency

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