S-shaped channel solder ejecting head driven by ampere force

Abstract

The invention provides an S-shaped channel solder ejecting head driven by ampere force, and relates to a solder micro-molten-droplet ejecting device. The S-shaped channel solder ejecting head is provided with a base body, a spray nozzle, a heating chamber, a heating coil, a conducting film, a pressure sensor, an air leakage pipe and an electromagnetic valve. The base body is provided with an S-shaped bent channel. The wall face of the channel is plated with a conducting film which serves as an electrode. An electrode wire lead-out hole is formed in the base body. The conducting film is electrically connected with the outer portion. The spray nozzle is arranged at the bottom of the base body and communicated with the bottom end of the channel. The heating chamber is arranged above the base body. A cover plate is arranged at the upper end of the heating chamber. The heating coil is arranged on the periphery of the heating chamber. The pressure sensor is arranged on the cover plate. The air leakage pipe is arranged on the cover plate, provided with an air leakage hole and communicated with an external air source through the electromagnetic valve. The ampere force borne by molten solder can be increased, and meanwhile the acceleration distance of the molten solder is lengthened so that ejecting can be more easily achieved.

Description

technical field [0001] The invention relates to a solder droplet spraying device, in particular to a device that can be used in the manufacture of wires, pin welding or solder balls of electronic circuits, and can also be used in three-dimensional molding, using ampere force to drive and spray metal solder Ampere-force-driven S-channel solder jetting head. Background technique [0002] With the rapid development of microelectronics technology and the increasing scope of application, integrated circuit chips are developing in the direction of high performance, high reliability and low cost. With the improvement of the integration level, higher requirements are put forward for the packaging process of the circuit. At present, the methods for making solder bumps mainly include photolithography, vapor deposition, etching, sputtering, and electroplating. Because the vacuum process is complex and time-consuming, the equipment is expensive, photolithography and electroplating nee...

AI Technical Summary

Problems solved by technology

However, this method requires a large current to achieve spraying, and metals with higher resistivity receive less electromagnetic force, so the applicable materials are limited.

And because the electromagnetic driving force produced by the device is small, the duty ratio required for spraying is large, resulting in low spraying frequency, and the diameter of the formed metal droplet is large, reaching 2mm

In addition, the device is relatively large

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