Curable silicone composition, cured product thereof, and optical semiconductor device
A technology of optical semiconductors and compositions, applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of reduced reliability, reduced adhesion and transparency of optical semiconductor devices, and achieve excellent initial performance Effects of adhesion and transparency, excellent adhesion durability and transparency retention, and excellent reliability
Inactive Publication Date: 2014-12-10
DOW CORNING TORAY CO LTD
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Problems solved by technology
[0005] Furthermore, the curable silicone composition proposed in Japanese Unexamined Patent Application Publication No. 2010-248384 has a cured product obtained from the composition exhibiting decreased adhesion over time under high-temperature and high-humidity conditions and the issue of transparency
Therefore, use of the composition as a sealant or an adhesive for an optical semiconductor element causes a problem that the reliability of an optical semiconductor device is significantly lowered under high-temperature and high-humidity conditions
Method used
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[0056] The curable silicone composition of the present invention, its cured product, and an optical semiconductor device will now be illustrated using examples. In addition, the physical property values are values measured at 25° C., and the properties of cured products were measured as follows.
[0057] [Hardness of cured product]
[0058] A cured product was prepared by heating the curable silicone composition at 150° C. for 1 hour. The hardness of the cured product was measured using a Type A durometer specified in JIS K 6253.
[0059] Subsequently, the cured product was exposed at a temperature of 85° C. and a relative humidity of 85% for 1,000 hours. The hardness of the cured product after being treated under high-temperature and high-humidity conditions was measured in the same manner as described above.
[0060] [Light transmittance of cured product]
[0061] A cured product having an optical path length of 1.0 mm was prepared by heating the curable silicone...
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Abstract
A curable silicone composition comprising: (A) (A1) an organopolysiloxane having at least two alkenyl groups in a molecule and free of silicon-bonded hydroxyl groups or silicon-bonded hydrogen atoms, or a mixture of said component (A1) and (A2) a branched chain organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) a diorganodialkoxysilane represented by a general formula; (D) a straight chain organosiloxane oligomer having at least one silicon-bonded hydroxyl group in a molecule and free of silicon-bonded hydrogen atoms; and (E) a hydrosilylation catalyst, can form a cured product which exhibits excellent initial adhesive properties and transparency and exhibits excellent adhesive durability and retention of transparency under conditions of high temperature and high humidity.
Description
technical field [0001] The present invention relates to a curable silicone composition, its cured product, and an optical semiconductor device using the cured product. [0002] This application claims priority from Japanese Patent Application No. 2012-079251 filed on Mar. 30, 2012, the contents of which are incorporated herein by reference. Background technique [0003] The hydrosilylation reaction-curable silicone composition forms a cured product having excellent properties such as weather resistance and heat resistance, and thus is used in various applications. However, such compositions exhibit poor adhesion. Accordingly, curable silicone compositions comprising an adhesion-imparting agent have been proposed. For example, Japanese Unexamined Patent Application Publication No. 2008-528788 proposes a curable silicone composition comprising: an acryloxy-functional alkoxysilane or a methacryloxy-functional alkane oxysilanes, alkenyl-functional silanol-terminated organopol...
Claims
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IPC IPC(8): C08L83/04H01L23/29
CPCH01L23/24H01L23/3107C08G77/16H01L33/56C08G77/045C08L83/04H01L23/296C08K5/5425H01L2224/48091C08K5/5435C08G77/20H01L2224/73265C08G77/12C08L83/00H01L2924/00014C09J183/04
Inventor 宫本侑典吉武诚
Owner DOW CORNING TORAY CO LTD