Adhesive-free polyimide copper-clad plate, and manufacturing method and application thereof

Abstract

The invention relates to a manufacturing method of an adhesive-free polyimide copper-clad plate. The manufacturing method comprises the following steps: S1: blending short fibers or fiber powder in a DMT solution containing 12%-23% of polyamide acid according to weight percentage, and stirring and blending uniformly; S2: uniformly coating the mixture on a copper foil and heating to remove a solvent in the DMF solution, wherein the heating temperature is 150-250 DEG C; S3: continuing to heat to 300-450 DEG C to achieve imidization of the polyamide acid, forming the polyimide and firmly adhering the polyimide on the copper foil, so as to obtain the adhesive-free polyimide copper-clad plate. The fiber component is added into the polyimide, the costs for manufacturing the copper-clad plate and a circuit board are lowered, the strengths of the copper-clad plate and the circuit board are improved, the expansion and the shrinkage are small, the size is stable, and the quality stability of the copper-clad plate and the circuit board is improved. In addition, no adhesive is used, the materials used are saved, the manufacturing process is reduced, and the production cost is lowered.

Description

technical field [0001] The invention relates to the improvement technology of circuit boards. Background technique [0002] Traditional circuit boards, especially traditional flexible circuit boards, usually use heat-resistant resin as the cover film of the solder mask layer, such as polyimide film (PI film), which is costly, so we found through a lot of experiments , Many types of paper can withstand the soldering temperature, such as kraft paper, etc. The present invention uses paper-based materials to make cover films and has achieved success. The use of paper-based materials to make cover films has stable dimensions and low cost. [0003] Moreover, the existing covering films are all bonded to the copper foil through an adhesive, which has high requirements for the adhesive, high cost, and many manufacturing processes. Contents of the invention [0004] In order to overcome the deficiencies in the prior art, one of the objectives of the present invention is to provide...

AI Technical Summary

Problems solved by technology

[0003] Moreover, the existing cover films are bonded to the copper foil through adhesives, which require higher requirements for adhesives, higher costs, and more manufacturing processes.