Insulating resin composition for printed circuit board, insulating film, prepreg, and printed circuit board
A technology of printed circuit boards and resin compositions, applied in the fields of printed circuits, printed circuits, printed circuit manufacturing, etc., which can solve the problems that the glass transition temperature of printed circuit boards cannot be implemented, and the Internet cannot be formed.
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preparation Embodiment 1
[0103] 218.26g (2.0mol) 4-aminophenol, 415.33g (2.5mol) isophthalic acid, 276.24g (2.0mol) 4-hydroxybenzoic acid, 282.27g (1.5mol) 6-hydroxy-2- Naphthoic acid, 648.54g (2.0mol) 10-(2,5-dihydroxyphenyl)-10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO-HQ) and 1531.35g (15.0mol) of acetic anhydride was added to a 20L glass reactor, after replacing it with nitrogen in the glass reactor, when the temperature in the reactor rose to 230°C and maintained at this temperature and under nitrogen flow conditions, The mixture was refluxed for 4 hours. Subsequently, 188.18 g (1.0 mol) of 6-hydroxy-2-naphthoic acid was added for end-capping, and then the by-product acetic acid and unreacted acetic anhydride were removed in order to prepare the liquid crystal oligomer.
[0104] Preparation of resin composition and insulating film
Embodiment 1
[0106] 28.12g of N,N'-dimethylacetamide (DMAc) solvent was mixed with 4g of phenylmethane maleimide oligomer and 20g of the liquid crystal oligomer prepared in Preparation Example 1, and then After stirring for about 1 hour, 16 g of epoxy resin Araldite MY-721 (Huntsman Corporation) was added thereto, followed by stirring for about 2 hours. Subsequently, 0.16 g of dicyandiamide (DICY) and 0.1 g of azobisisobutyronitrile (AIBN) were added thereto, and then stirred for about 1 hour to dissolve all of them to prepare a resin composition. The resin composition is appropriately poured on a copper foil with a shiny surface, and then an insulating film with a thickness of about 150 μm is formed by a film caster for laboratory use. The insulating film was initially dried in an oven at about 80°C for 30 minutes to remove volatile solvents. Subsequently, the insulating film was dried a second time at about 120° C. for 60 minutes to obtain an insulating film in a B-stage state.
Embodiment 2
[0108] Mix 44.29g of N,N'-dimethylacetamide (DMAc) solvent with 7.5g of phenylmethane maleimide oligomer and 15g of the liquid crystal oligomer prepared in Preparation Example 1. Then it was stirred for about 1 hour, 15 g of epoxy resin Araldite MY-721 (Huntsman Corporation) was added thereto, and then stirred for about 2 hours. Subsequently, 0.15 g of dicyandiamide (DICY) and 0.1875 g of azobisisobutyronitrile (AIBN) were added thereto, and then stirred for about 1 hour to dissolve all of them to prepare a resin composition. The resin composition was appropriately poured on a copper foil with a glossy surface, and then an insulating film with a thickness of about 150 μm was formed using a film continuous casting machine for laboratory use. The insulating film was initially dried in an oven at about 80°C for 30 minutes to remove volatile solvents. Subsequently, the insulating film was dried a second time at about 120° C. for 60 minutes to obtain an insulating film in a B-stage...
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