Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Negative photosensitive composition capable of curing at low temperature

A technology of photosensitive composition and compound, which is applied in the direction of optics, photomechanical equipment, photoplate process of pattern surface, etc., can solve the problems of compromising the storage stability of the composition, and the stability of the low-temperature curing composition has not been found, and achieves High chemical resistance, high environmental tolerance, excellent stability effect

Active Publication Date: 2020-01-03
MERCK PATENT GMBH
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to reduce the production cost, the heating temperature is preferably low. Therefore, if the reactivity of the silanol group is increased in order to reduce the heating temperature, the storage stability of the compound containing the silanol group or the composition containing it will be impaired in many cases.
Thus, no composition has been found that achieves both the possibility of low-temperature curing and the stability of the composition

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Negative photosensitive composition capable of curing at low temperature
  • Negative photosensitive composition capable of curing at low temperature
  • Negative photosensitive composition capable of curing at low temperature

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0186] Polysiloxane S1, polyoxysilane S2, vinyl acrylic polymer A1-1 (weight average molecular weight 12,000, double bond equivalent 24g / eq, acid value 19mgKOH / g), carboxyl acrylic polymer A2- 1 (weight average molecular weight 7,500, acid value 120-130 mgKOH / g) was mixed at a ratio of 10:20:40:30 to obtain a polymer mixture. Regarding this polysiloxane mixture S1, the dissolution rate relative to 2.38% TMAH aqueous solution after prebaking is / sec, the weight-average molecular weight is 1,750, and for this polysiloxane mixture S2, the dissolution rate relative to the 5.00% TMAH aqueous solution after prebaking is / sec, and the weight average molecular weight is 2,700. To this polymer mixture, 25 parts by weight of tris(2-acryloyloxyethyl)isocyanurate (M1) and dipentaerythritol hexaacrylate (M2) were added as a (meth)acryloyl compound. 12 parts by weight, 6.0 parts by weight of Irgacure OXE-02 (PI) as a polymerization initiator, and 8 parts by weight of silicon compound SQ...

Embodiment 2～13、 comparative example 1～4

[0191] With respect to Example 1, it evaluated similarly to Example 1 by preparing the negative photosensitive composition which changed the component as shown in Table 1. The obtained results are shown in Table 1.

[0192] 【Table 1】

[0193]

[0194] In the table:

[0195] Acrylic polymer A1-2: Acrylic polymer having a vinyl group (weight average molecular weight 10,000, double bond equivalent 105 g / eq, acid value 20 mgKOH / g)

[0196] Acrylic polymer A2-2: an acrylic polymer having a carboxyl group (weight average molecular weight: 15,000, acid value: 120 to 130 mgKOH / g)

[0197] The evaluation criteria for each characteristic are as follows:

[0198] Residue after development

[0199] The film surface after development was observed and evaluated with the optical microscope.

[0200] A: No residue

[0201] B: There are some residues on the lower side of the pattern

[0202] C: Has a thin layer of residue

[0203] D: with thick layered residue

[0204] Residual...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Acid valueaaaaaaaaaa
Acid valueaaaaaaaaaa
Double bond equivalentaaaaaaaaaa
Login to View More

Abstract

The invention provides a negative photosensitive composition being capable of low temperature curing. A cured film with high transparency and high chemical resistance can be obtained. A pattern forming method employing the composition is provided. The negative photosensitive composition is characterized by comprising a polysiloxane, (methyl) acrylic polymers, a compound comprising more than two (methyl) acryloyl groups, a polymerization initiator and a solvent.

Description

technical field [0001] This invention relates to a negative photosensitive composition. Moreover, this invention also relates to the manufacturing method of the cured film using it, the cured film formed therefrom, and the element which has this cured film. Background technique [0002] In recent years, in optical elements such as displays, light-emitting diodes, and solar cells, various proposals have been made for the purpose of improving light utilization efficiency and saving energy. For example, in terms of liquid crystal displays, it is known to form a transparent planarization film over a thin film transistor (hereinafter sometimes referred to as TFT) element, and form a pixel electrode on the planarization film, thereby increasing the opening of the display device. rate method (refer to Patent Document 1). [0003] Such a flattening film can be formed, for example, by condensing a compound having a silanol group such as polysiloxane. In order to rapidly proceed th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G03F7/075G03F7/00
Inventor 横山大志能谷敦子田代裕治吉田尚史野中敏章
Owner MERCK PATENT GMBH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com