Semiconductor element structure and manufacturing method thereof

Abstract

The invention discloses a semiconductor element and a manufacturing method of the semiconductor element. The manufacturing method comprises the steps that a substrate is firstly provided, at least one first transistor is formed on the substrate, a first conduction type is included, and the first transistor comprises a first metal grid and a protection layer covering the side wall of the first metal grid; then, part of the first metal grid is removed to form a first groove to expose part of the protection layer, and a second groove is formed by removing the exposed part of the protection layer after the first groove is formed to form. After the second groove is formed, an contact etch stop layer is formed in the second groove.

Description

technical field [0001] The invention relates to a semiconductor structure and a manufacturing method thereof, in particular to a semiconductor element with a metal gate and a contact plug and a manufacturing method thereof. Background technique [0002] In an integrated circuit (IC), various semiconductor elements are electrically connected to each other through contact structures such as contact plugs and interconnection structures. However, as integrated circuits continue to be integrated and feature sizes continue to decrease, the line width and geometric size of semiconductor devices are also getting smaller and smaller. Under the trend of narrowing width, any alignment error in the manufacture of contact plugs may cause offset of the contact plugs, and then lead to short circuits within or between components. When a contact plug alignment problem occurs within the device, such as between the gate structure and the source / drain, and causes a short circuit, it will lead ...

AI Technical Summary

Problems solved by technology

Under the trend of shrinking width, any alignment error in the manufacture of contact plugs may cause the offset of contact plugs, which may lead to short circuits within or between components

When a contact plug alignment problem occurs within the component, such as between the gate structure and the source / drain, and causes a short circuit, it will lead to failure of the semiconductor component; while a short circuit between components is more likely to cause the failure of the entire IC

[0003] Therefore, there is still a need for a semiconductor element and its manufacturing method to effectively avoid problems such as short circuit caused by contact plug offset and element failure.

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