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Refrigerating pump regeneration control method and system

A control method and technology for a control system, which are applied in the field of semiconductor equipment process control, can solve problems such as lack of equipment management and coordination, and achieve the effects of avoiding the problem of gas backflow, reducing the probability of misoperation, and improving the convenience of operation.

Active Publication Date: 2015-01-14
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] The technical problem to be solved by the embodiments of the present invention is to provide a cold pump regeneration control method to solve the problem of lack of management and coordination of the entire equipment when the cold pump performs the regeneration operation, so as to make the cold pump regeneration safer

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  • Refrigerating pump regeneration control method and system
  • Refrigerating pump regeneration control method and system
  • Refrigerating pump regeneration control method and system

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Embodiment Construction

[0062] In order to make the above objects, features and advantages of the embodiments of the present invention more comprehensible, the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0063] refer to Figure 5 , shows a flow chart of the steps of an embodiment of a cold pump regeneration control method embodiment of the present invention, as shown in Figure 5 As shown, the cold pump is connected to the dry pump of the system, and the control method for regeneration of the cold pump includes the following steps:

[0064] Step 501, receiving a regeneration execution request submitted by a cold pump waiting for regeneration, and applying for the right to use the dry pump of the system according to the request;

[0065] Step 502, when obtaining the right to use the dry pump of the system, close all the exhaust valves associated with the dry pump of the system;

[...

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Abstract

The embodiment of the invention provides a refrigerating pump regeneration control method. A refrigerating pump is connected with a system dry pump. The method includes the following steps that a regeneration execution request submitted by the refrigerating pump to regenerated is received, and the right to the use of the system dry pump is applied for according to the request; when the right to the use of the system dry pump is obtained, all air pumping valves associated with the system dry pump are closed; the refrigerating pump to be regenerated and gate valves of corresponding cavities of the refrigerating pump are closed; a regeneration start command is sent to the refrigerating pump to be regenerated; the refrigerating pump to be regenerated is used for executing regeneration according to the regeneration command; when the refrigerating pump to be regenerated finishes regeneration, the right to the use of the dry system is released. According to the method, the system dry pump is set as the shared resources to manage and coordinate the refrigerating pump to execute regeneration, automated management and coordination of devices are achieved in the regeneration process of the refrigerating pump, and the problem of gas backward flowing caused by misoperation is avoided.

Description

technical field [0001] The invention relates to the field of semiconductor equipment process control, in particular to a cold pump regeneration control method and a cold pump regeneration control system. Background technique [0002] With the development of semiconductor process technology, the process is becoming more and more complex. [0003] For example, as the dimensions of CMOS transistors continue to shrink to the sub-micron level, as predicted by Moore's Law, the number of transistors in high-efficiency, high-density integrated circuits rises to tens of millions. The signal integration of these huge number of active components requires more than ten layers of high-density metal wiring. However, the resistance and parasitic capacitance brought by these metal interconnections have become the main factors that limit the speed of this efficient integrated circuit. Driven by this factor, the semiconductor industry has developed from the original metal-aluminum interconne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F04B49/06F04B37/08C23C14/56
Inventor 杨洋
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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